ECG002F-G TriQuint, ECG002F-G Datasheet - Page 6

RF Amplifier DC-6 GHz 20dB Gain at 1 GHz

ECG002F-G

Manufacturer Part Number
ECG002F-G
Description
RF Amplifier DC-6 GHz 20dB Gain at 1 GHz
Manufacturer
TriQuint
Type
General Purpose Amplifierr
Datasheet

Specifications of ECG002F-G

Operating Frequency
0 Hz to 6000 MHz
P1db
15.5 dBm at 1 GHz
Noise Figure
3.78 dB
Operating Supply Voltage
3.9 V
Supply Current
45 mA
Maximum Operating Temperature
+ 160 C
Mounting Style
SMD/SMT
Package / Case
SOT-363
Number Of Channels
1 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
1066901

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ECG002F-G
Manufacturer:
IR
Quantity:
5 000
ECG002
InGaP HBT Gain Block
TriQuint Semiconductor, Inc
This package is lead-free/Green/RoHS-compliant. The plating material on the leads is annealed matte tin over copper. It is compatible with
both lead-free (maximum 260 C reflow temperature) and leaded (maximum 245 C reflow temperature) soldering processes.
Phone +1-503-615-9000
Outline Drawing
Land Pattern
ECG002F-G Mechanical Information
FAX: +1-503-615-8900
XX5
e-mail: info-sales@tqs.com
Web site: www.TriQuint.com
Specifications and information are subject to change without notice
The component will be marked with a two-
digit numeric lot code (shown as “XX”)
followed with a “5” designator on the top
surface of the package.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
ESD Rating: Class 1A
Value:
Test:
Standard:
MSL Rating: Level 3 at +260 C convection reflow
Standard:
1. Ground / thermal vias are critical for the proper performance of
2. Add as much copper as possible to inner and outer layers near
3. Mounting screws can be added near the part to fasten the board
4. Do not put solder mask on the backside of the PC board in the
5. RF trace width depends upon the PC board material and
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches).
Mounting Config. Notes
this device. Vias should use a .35mm (#80 / .0135”) diameter
drill and have a final plated thru diameter of .25 mm (.010”).
the part to ensure optimal thermal performance.
to a heatsink.
contacts the heatsink.
region where the board contacts the heatsink.
construction.
degrees.
Product Marking
MSL / ESD Rating
Passes between 250 and 500V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
JEDEC Standard J-STD-020
Ensure that the ground / thermal via region
Page 6 of 7 August 2009
Angles are in

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