TGA4811 TriQuint, TGA4811 Datasheet
TGA4811
Specifications of TGA4811
Available stocks
Related parts for TGA4811
TGA4811 Summary of contents
Page 1
... Chip Dimensions: 1.30 x 1.06 x 0.1 mm Primary Applications • 0 • -4 • -8 Description -12 The TriQuint TGA4811 -16 GHz low noise amplifier that typically -20 provides 15 dB small signal gain and input and output return loss is <10dB. -24 Normal Noise Figure is 3.0 dB from GHz. P1dB is 13 dBm. ...
Page 2
... Junction operating temperature will directly affect the device median time to failure (MTTF). For maximum life recommended that junction temperatures be maintained at the lowest possible levels. TriQuint Semiconductor Texas www.triquint.com Phone: (972)994 8465 Fax: (972)994 8504 info-mmw@tqs.com TABLE I MAXIMUM RATINGS 1/ PARAMETER TGA4811 VALUE NOTES 6 200m A ...
Page 3
... Note: Die backside epoxy attached to carrier at 70°C baseplate temperature. TriQuint Semiconductor Texas www.triquint.com Phone: (972)994 8465 Fax: (972)994 8504 info-mmw@tqs.com TABLE II ELECTRICAL CHARACTERISTICS ( Nominal) TABLE III THERMAL INFORMATION Test Conditions 0. Pdiss = 0.3 W TGA4811 TYPICAL UNITS - dBm 15 dBm 3 θ ...
Page 4
... P1dB at 6V, P1dB at 4.5V, 4.5V, TriQuint Semiconductor Texas www.triquint.com Phone: (972)994 8465 Fax: (972)994 8504 info-mmw@tqs.com Measured Data Bias Conditions Fre que ncy (GHz Frequency (GHz) TGA4811 -12 -16 -20 - May 2006 ...
Page 5
... Bias Conditions -11 -10 -9 TriQuint Semiconductor Texas www.triquint.com Phone: (972)994 8465 Fax: (972)994 8504 info-mmw@tqs.com Measured Data Frequency (GHz) 6V, 52mA 4.5V, 42mA 6V, 52mA 4.5V, 42mA - Pin (dBm) TGA4811 May 2006 ...
Page 6
... Chip edge to bond pad dimension are shown to center of bond pad. Chip size tolerance: ± 0.051 TriQuint Semiconductor Texas www.triquint.com Phone: (972)994 8465 Fax: (972)994 8504 info-mmw@tqs.com Mechanical Drawing V D Pad size (mm) VD 0.10x0.10 VG1 0.10x0.10 VG2 0.10x0. 0.10x0.10 RF OUT 0.10x0.10 TGA4811 RF OUT May 2006 ...
Page 7
... RF IN and RF OUT. Vg2 is optional for the circuit. * 1800pF & 0.1uF capacitors can be substituted with the following integrated capacitors: Part Number GZ0SYC104KJ8182MAW VB4080X7R105Z16VHX182 TriQuint Semiconductor Texas www.triquint.com Phone: (972)994 8465 Fax: (972)994 8504 info-mmw@tqs.com Vd Vg2 * 0.1uF 100pF 1800pF RF OUT 1800pF * 0.1uF Vg1 M anufacturer AVX Presidio TGA4811 7 May 2006 ...
Page 8
... Part Number GZ0SYC104KJ8182MAW VB4080X7R105Z16VHX182 TriQuint Semiconductor Texas www.triquint.com Phone: (972)994 8465 Fax: (972)994 8504 info-mmw@tqs.com 1800pF 0.1uF V Vd(RFout) TGA4811 0.1uF 1800pf Manufacturer AVX Presidio TGA4811 (No Connection) d VDT Bias Tee RF(out) (PSPL 5542) Vg1 8 May 2006 ...
Page 9
... B. If Biasing Drain through Bias Tee and RF port 1. Leave Increase Adjust Vg to reach Increase Repeat steps 3 and 4 until correct bias is reached (i. 50mA Bias-down device, turn and decrease TriQuint Semiconductor Texas www.triquint.com Phone: (972)994 8465 Fax: (972)994 8504 info-mmw@tqs.com TGA4811 9 May 2006 ...
Page 10
... Thermosonic ball bonding is the preferred interconnect technique. • Force, time, and ultrasonics are critical parameters. • Aluminum wire should not be used. • Maximum stage temperature is 175 TriQuint Semiconductor Texas www.triquint.com Phone: (972)994 8465 Fax: (972)994 8504 info-mmw@tqs.com Assembly Process Notes o C. TGA4811 May 2006 ...