1871602-2 TE Connectivity, 1871602-2 Datasheet - Page 106

MICRO SD CONNECTOR ASSY WITH BOSS

1871602-2

Manufacturer Part Number
1871602-2
Description
MICRO SD CONNECTOR ASSY WITH BOSS
Manufacturer
TE Connectivity
Type
Micro SD Cardr
Datasheet

Specifications of 1871602-2

Ejector Type
Push-On Push-Off
Gender
HDR
Mounting Style
Surface Mount
Termination Method
Solder
Body Orientation
Right Angle
Housing Material
Thermoplastic
Number Of Contact Rows
1
Number Of Contacts
8POS
Voltage Rating Max
100VAC
Current Rating (max)
0.5/ContactA
Contact Material
Copper Alloy
Operating Temp Range
-25C to 90C
Insertion Force
40
Product Length (mm)
14.6mm
Mount Angle
Right Angle
Pcb Mount Style
Surface Mount
Holddowns
With
Solder Tail Contact Plating
Tin
Polarizing Post Length (mm [in])
0.45 [0.018]
Lead Type
Surface Mount - Inline leads
Contact Plating, Mating Area, Material
Gold
Contact Base Material
Copper Alloy
Housing Color
Black
Ul Flammability Rating
UL 94V-0
Operating Function
Push-On Push-Off
Rohs/elv Compliance
RoHS compliant, ELV compliant
Lead Free Solder Processes
Reflow solder capable to 245°C
Rohs/elv Compliance History
Always was RoHS compliant
Format
Micro Secure Digital Card
Packaging Method
Tape & Reel
Lead Free Status / RoHS Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
1871602-2
Manufacturer:
AMP
Quantity:
38 068
Kapton
Tyco Electronics polyimide (Kapton
temperature labeling requirements such as printed circuit boards.
They are suitable for direct wave (bottom side) and IR reflow
(top side) PCB applications. Tyco Electronics Kapton
designed to withstand the fluxes, cleaning solvents and molten
solder encountered in the manufacture of printed circuit boards.
They offer excellent contrast for bar code applications.
Tyco Electronics Kapton
high temperature applications. For reliable print performance
and durability, use with Tyco Electronics’s RHT-45 series ribbon.
Features and Benefits
T1K
T2K
KTT
TSK
T2Y
104
UL Listed: T1K, T2K & TSK
Thermal transfer printable
High temperature permanent acrylic adhesive
Gloss white topcoat
Withstands surface mount board processes on either the top
or bottom side of the board.
Low profile 1 mil film offers polyimide thermal performance
at competitive cost.
Ideal for manual apply applications.
Gloss white topcoat
Withstands surface mount board processes on either the top
or bottom side of the board.
Ideal for auto apply applications.
Matte tan topcoat
Withstands surface mount board processes on either the top
or bottom side of the board.
Product approved for aerospace/defense applications.
Low outgassing
High opacity gloss white topcoat.
Withstands surface mount board processes on either the top
or bottom side of the board.
Deemed to be a static safe product in accordance with
EIA 625, EIA 541. Test methods employed were in accordance
with EOS/ESD S11.11.
Ideal for auto apply applications.
High opacity gloss white topcoat.
Economic alternative to T1K material.
Withstands surface mount board processes on either the top or
bottom side of the board – can also be used on the top side of the
board in mixed processes, but it is not recommended for the bottom
side which is directly exposed to the wave solder environment.
®
Labels
®
labels are suitable for the harshest
Products for Mobile Equipment
Labels
Kapton
All specifications subject to change. Consult Tyco Electronics for latest specifications.
®
) labels are all ideal for high
®
Labels
®
labels are
Specifications:
Adhesive:
Service Temperature:
T1K
T2Y
Recommended Printer:
T1K, T2K, TSK, T2Y, T2Y, KTT
Recommended Ribbon:
Part Numbering System
T1K-044033-10-9
1
3
, T2K
2
, TSK
2
, KTT
2
T1K
T2K
TSK
Permanent Acrylic
–40 °C to +260 °C
–40 °C to +232 °C
1 Flash exposure to +472 °C
2 Flash exposure to +538 °C
3 Flash exposure to +316 °C
T312S
1330-0619-10
) Alternative printers and ribbons are
available for special applications.
Contact Tyco Electronics for more
information.
Color
Pack Size
Label Height (mm)
Label Width (mm)
Product Family
Catalog 1654270-2
TTDS-034
TTDS-035
TTDS-085
Revised 8-2007

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