1871602-2 TE Connectivity, 1871602-2 Datasheet - Page 77

• Manufacturer Part Number: 1871602-2
• Description: MICRO SD CONNECTOR ASSY WITH BOSS
• Manufacturer: TE Connectivity
• Type: Micro SD Cardr

Specifications of 1871602-2

• Ejector Type: Push-On Push-Off
• Gender: HDR
• Mounting Style: Surface Mount
• Termination Method: Solder
• Body Orientation: Right Angle
• Housing Material: Thermoplastic
• Number Of Contact Rows: 1
• Number Of Contacts: 8POS
• Voltage Rating Max: 100VAC
• Current Rating (max): 0.5/ContactA
• Contact Material: Copper Alloy
• Operating Temp Range: -25C to 90C
• Insertion Force: 40
• Product Length (mm): 14.6mm
• Mount Angle: Right Angle
• Pcb Mount Style: Surface Mount
• Holddowns: With
• Solder Tail Contact Plating: Tin
• Polarizing Post Length (mm [in]): 0.45 [0.018]
• Lead Type: Surface Mount - Inline leads
• Contact Plating, Mating Area, Material: Gold
• Contact Base Material: Copper Alloy
• Housing Color: Black
• Ul Flammability Rating: UL 94V-0
• Operating Function: Push-On Push-Off
• Rohs/elv Compliance: RoHS compliant, ELV compliant
• Lead Free Solder Processes: Reflow solder capable to 245°C
• Rohs/elv Compliance History: Always was RoHS compliant
• Format: Micro Secure Digital Card
• Packaging Method: Tape & Reel
• Lead Free Status / RoHS Status: Compliant

Mini SIM
Card Packaging
Tyco Electronics propose
a new Packaging for the
3
The leadframe is over moulded
with a plastic package at
dimension close to the final
Mini SIM card body.
This technology allows our
customers to work directly
on advanced product and
use their standard available
reel-to-reel equipments.
rd
Generation of SIM Cards
Products for Mobile Equipment
Mechatronic Center Niefern
Mini SIM Card Packaging
Key Features
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Produced with the Standard
Tyco Electronics Technologies
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All specifications subject to change. Consult Tyco Electronics for latest specifications.
Microelectronic can be made on semi final packaging, no module out cutting and embedding
operation.
Lower risk and process time improvement.
Personalisation can be realized separately on tapes, and bring together by a final operation.
No additional card body is needed, but also possibility to plug in 1
High-speed stamping
Selective plating
Laminating
Reel-to-reel over moulding
st
or 2
nd
card body generation.
Catalog 1654270-2
Revised 8-2007
75