BDN09-3CB/A01 CTS, BDN09-3CB/A01 Datasheet
BDN09-3CB/A01
Manufacturer Part Number
BDN09-3CB/A01
Description
Manufacturer
CTS
Type
Passiver
Datasheet
1.BDN09-3CBA01.pdf
(2 pages)
Specifications of BDN09-3CB/A01
Fin Style
Pin Array
Finish
Black Anodized
Product Length (mm)
23.114mm
Product Height (mm)
9.017mm
Product Depth (mm)
23.114mm
Attachment Method
Adhesive Tape
Lead Free Status / RoHS Status
Compliant
A
• Pre-applied adhesive − just peel off the release
• Reduces assembly costs − no more messy
• Excellent mechanical bond
• Thermally optimized pin fin
• Omnidirectional
• Adhesive shear strenght at 100ºC is 36 psi. A
• Applicable for BGA, PGA, PLCC, and QFP
Page 1 of 2
ELECTRONIC COMPONENTS
ADHESIVE PEEL AND STICK HEAT SINKS
•
•
•
•
•
•
•
NOTES:
***
liner and press onto the component
adhesives or greases required
one inch square heat sink would require 36 lb. of
force to remove heat sink.
packages
dhesive
**
messy adhesives or greases required
require a 36lb. force to remove heat sink)
and QFP packages
With pre-applied adhesive, just peel
Thermally optimized pin fin
Adhesive shear strength at 100°C is
Applicable for BGA, PGA, PLCC,
off the release liner and press onto the
component
Reduces assembly costs; no more
Excellent mechanical bond
Omnidirectional
36psi (a one inch square heat sink would
*
Part numbers
Thermal resistance
Thermal resistance
of adhesive tape is
included.
values based on
power density of
3 watts/in.
listed for standard
black anodized
heat sinks with
CTS adhesive
tapes.
2
P
eel And
All dimensions are in inches.
BDN09-3CB/A01
BDN09-6CB/A01
BDN10-3CB/A01
BDN10-5CB/A01
BDN12-3CB/A01
BDN12-5CB/A01
BDN13-3CB/A01
BDN13-5CB/A01
BDN14-3CB/A01
BDN14-6CB/A01
BDN15-3CB/A01
BDN15-5CB/A01
BDN16-3CB/A01
BDN16-6CB/A01
BDN17-3CB/A01
BDN18-3CB/A01
BDN18-6CB/A01
BDN19-3CB/A01
BDN21-3CB/A01
BDN11-3CB/A01
BDN11-6CB/A01
PART NUMBER ***
HEAT SINK
s
tick
A
luminum
0.91
1.01
1.11
1.21
1.31
1.41
1.51
1.61
1.71
1.81
1.91
2.11
(W)
HEAT SINK SPECIFICATIONS
H±0.015
0.91
1.01
1.11
1.21
1.31
1.41
1.51
1.61
1.71
1.81
1.91
2.11
(L)
SIZE
h
.355
.605
.355
.555
.355
.605
.355
.555
.355
.555
.355
.605
.355
.555
.355
.605
.355
.355
.605
.355
.355
eAt
(H)
Series BND Extruded Heat Sinks
Technical
s
.09
.10
.09
.10
.09
.10
.09
.10
.09
.10
.09
.10
.09
.10
.09
.10
.09
.09
.10
.09
.09
G±0.01
T
inks
L±0.01
.069
.132
.083
.111
.076
.119
.060
.105
.074
.125
.067
.128
.062
.118
.072
.119
.065
.072
.128
.069
.064
PIN FIN CONFIGURATION
P
.072
.128
.072
.114
.072
.128
.081
.114
.081
.114
.081
.128
.081
.114
.081
.128
.072
.072
.114
.072
.072
G
MATRIX
10x10
13x13
13x13
14x14
16x16
11x11
11x11
7x7
4x4
7x7
5x5
8x8
5x5
9x9
6x6
9x9
6x6
6x6
7x7
7x7
8x8
FIN
W±0.01
P±0.01
CASE TO AMBIENT * °C/WATTS
CONVECTION **
NATURAL
THERMAL RESISTANCE
26.9
24.5
26.4
20.8
20.9
18.5
19.6
16.5
16.1
14.9
16.2
13.1
15.1
11.9
13.5
10.6
11.5
10.8
T±0.01
8.1
9.9
8.5
Data
CONVECTION
@ 400 LFPM
FORCED
August 2010
9.6
7.7
8.0
6.3
7.2
5.7
6.8
5.2
6.0
4.7
5.6
4.2
4.5
3.8
4.5
3.5
3.8
3.5
2.8
2.9
2.6
3
®
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BDN09-3CB/A01 Summary of contents
Page 1
... Applicable for BGA, PGA, PLCC, and QFP Applicable for BGA, PGA, PLCC, • packages and QFP packages HEAT SINK PART NUMBER *** BDN09-3CB/A01 BDN09-6CB/A01 BDN10-3CB/A01 BDN10-5CB/A01 BDN11-3CB/A01 BDN11-6CB/A01 BDN12-3CB/A01 BDN12-5CB/A01 BDN13-3CB/A01 ...
Page 2
... Double-sided acrylic adhesive loaded with aluminum oxide on an aluminum foil carrier Double-sided silicone adhesive with expanded aluminum mesh carrier Doubled-sided acrylic adhesive loaded with titanium diboride on an expanded aluminum carrier Double-sided acrylic adhesive loaded with ceramic particles CTS ® Clip Size August 2010 ...