746610-1 TE Connectivity, 746610-1 Datasheet - Page 3

• Manufacturer Part Number: 746610-1
• Description: Conn IDC Connector M 10 POS 2.54mm IDT RA Cable Mount
• Manufacturer: TE Connectivity
• Type: IDC Connectorr
• Series: AMP-LATCHr

Specifications of 746610-1

• Pitch: 2.54 mm
• Number Of Rows: 2
• Number Of Contacts: 10
• Gender: M
• Contact Plating: Bright Tin-Lead Over Nickel
• Termination Method: IDT
• Connector Type: Wire To Board
• Contact Termination: IDC / IDT
• No. Of Contacts: 10
• No. Of Rows: 2
• Pitch Spacing: 2.54mm
• Rohs Compliant: No
• Product Line: AMP-LATCH
• Termination Method To Pc Board: Through Hole - Solder
• Pcb Mounting Orientation: Vertical
• Pcb Mount Retention: Without
• Pcb Mount Alignment: Without
• Termination Method To Wire/cable: IDC
• Ul File Number: E28476
• Csa File Number: LR 7189
• Contact - Rated Current (a): 1
• Operating Voltage Reference: AC
• Operating Voltage (vac): 250
• Wire/cable Size (awg): 26 – 30
• Wire/cable Size (mm²): 0.051 – 0.15
• Wire/cable Size (cma): 101 – 296
• Tail Length (mm [in]): 3.96 [0.156]
• Tail Orientation: In-line
• Profile Height (y-axis) (mm [in]): 6.43 [0.253]
• Number Of Positions: 10
• Centerline (mm [in]): 2.54 [0.100]
• Row-to-row Spacing (mm [in]): 2.54 [0.100]
• Length (x-axis) (mm [in]): 17.27 [0.6799]
• Width (z-axis) (mm [in]): 7.06 [0.278]
• Contact Type: Pin
• Contact Base Material: Phosphor Bronze
• Contact Plating, Mating Area, Material: Gold or Palladium Nickel or Performance Based
• Contact Plating, Mating Area, Thickness (µm [?in]): 2.54 [100]
• Tail Plating Material: Tin-Lead
• Tail Plating, Thickness (µm [?in]): 2.54 [100]
• Connector Style: Plug
• Housing Color: Black
• Ul Flammability Rating: UL 94V-0
• Rohs/elv Compliance: Not ELV/RoHS compliant
• Lead Free Solder Processes: Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder capable to 265°C
• Agency/standard: UL, CSA
• Ul Rating: Recognized
• Ul Voltage Rating (vac): 250
• Operating Temperature (°c [°f]): -65 – +105 [-85 – +221]
• Applies To: Printed Circuit Board
• Accepts Wire Insulation Diameter, Range (mm [in]): 0.81 – 1.07 [0.032 – 0.042]
• Pcb Thickness, Recommended (mm [in]): 3.18 [0.125]
• Application Use: Wire-to-Board
• Contact Transmits (typical Application): Signal (Data)
• Packaging Method: Tube

3.6.
Rev A
Hum idity-tem perature cycling.
Tem perature life.
NOTE
Product Qualification and Requalification Test Sequence
NOTE
Test Description
Shall meet visual requirements, show no physical damage and shall meet requirements of
additional tests as specified in Test Sequence in Figure 2.
(a)
(b)
See paragraph 4.1.A.
Numbers indicate sequence in which tests are performed.
Exam ination of product
Term ination resistance
Insulation resistance
Dielectric withstanding voltage
Solderability
Vibration
Physical shock
Therm al shock
Hum idity-tem perature cycling
Tem perature life
Test or Exam ination
See Note.
See Note.
Figure 1 (end)
Requirem ent
Figure 2
1,6
2,5
1
3
4
Test Sequence (b)
1,5
2,4
Test Group (a)
2
3
1,5
2,4
3
3
TE Spec 109-23-3, Condition B.
Subject sam ples to 10 cycles
between 25 and 65 C at 95% RH.
TE Spec 109-43.
Subject sam ples to tem perature life
at 105 C for 1000 hours.
1,8
2,6
3,7
4
4
5
1,3
5
2
Procedure
108-40013
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