146130-1 TE Connectivity, 146130-1 Datasheet - Page 18

Conn Unshrouded Header HDR 4 POS 2.54mm Solder ST SMD

146130-1

Manufacturer Part Number
146130-1
Description
Conn Unshrouded Header HDR 4 POS 2.54mm Solder ST SMD
Manufacturer
TE Connectivity
Type
Unshrouded Headerr
Datasheet

Specifications of 146130-1

Pitch
2.54 mm
Number Of Rows
2
Number Of Contacts
4
Gender
HDR
Contact Plating
Gold Over Nickel
Termination Method
Solder
Rohs Compliant
NO
Product Type
Connector
Mount Angle
Vertical
Pcb Mount Retention
Without
Surface Mount Compatible
Yes
Board Standoff
Without
Mounting Ears
Without
Mating Connector Lock
Without
Breakaway Header
Yes
Pcb Mounting Orientation
Vertical
Post Size (mm [in])
0.64 [.025]
Mating Post Length (mm [in])
5.84 [0.230]
Panel Mount Retention
Without
Current Rating (a)
3
Insulation Resistance (m?)
5,000
Dielectric Withstanding Voltage (v)
750
Solder Tail Contact Plating
Tin-Lead over Nickel
Header Type
Breakaway
Number Of Positions
4
Centerline (mm [in])
2.54 [0.100]
Row-to-row Spacing (mm [in])
2.54 [0.100]
Selectively Loaded
No
Mount Type
Printed Circuit Board
Contact Plating, Mating Area, Material
Gold (30)
Contact Shape
Square
Contact Base Material
Phosphor Bronze
Housing Material
Thermoplastic - GF
Housing Color
Black
Ul Flammability Rating
UL 94V-0
Rohs/elv Compliance
ELV compliant, 5 of 6 Compliant
Lead Free Solder Processes
Reflow solder capable to 245°C, Reflow solder capable to 260°C
Approved Standards
UL E28476, CSA LR7189
High Temperature Housing
Yes
Temperature Range (°c)
-65 – +125
High Temperature Compatible
Yes
High Speed Serial Data Connector
No
2
18
Catalog 1307819
Revised 8-08
www.tycoelectronics.com
Product Facts
Surface-mount products for
right-angle board-to-board
and cable-to-board
applications
Double-row, right-angle
shrouded headers
High density .050 x .050
[1.27 x 1.27] centerline grid
Latching and non-latching
versions available
Non-protrusive metallic
holddowns
Metallic tabs, when
soldered to PC board pad,
provide added mechanical
support
Duplex plated post contacts;
gold plated on mating area,
tin plated on tails
Compatible with standard
surface-mount processing
(VPR and IR)
Standoffs on header
housings allow for drainage
of processing fluids
All headers are polarized
Sizes of 10, 20, 30, 40, 50,
60, 70, 80 and 100 positions
Recognized under the
Component Program of
Underwriters
Laboratories Inc.,
Certified by Canadian
Standards
Association
File No. LR7189
File No. E28476
R
are metric equivalents.
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
R
AMPMODU Interconnection System
Board-to-Board Right-Angle Headers
AMPMODU 50/50 Grid
Right-Angle Headers will
accommodate a variety of
high density packaging
applications; right-angle
board-to-board applications
when mated with vertical
receptacles (page 15) and
right-angle cable-to-board
applications when mated
with cable connectors
(page 21). The small
.050 x .050 [1.27 x 1.27]
centerline contact spacing
allows efficient use of the
PC board area.
Mechanical support of the
headers to the PC board is
provided by non-protrusive
metallic holddowns
designed for .062 [1.57] or
thicker PC boards. These
holddowns are of the same
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
design as those used in the
vertical headers (page 16)
and receptacles (page 15).
There are also metallic tabs
that are soldered to the sur-
faces of the PC board pads
for added support.
AMPMODU 50/50 Grid
Right-Angle Headers are
available in double-row, in
either latching or non-
latching versions, and in
sizes ranging from 10
through 100 positions (in 10
position increments). The
latching version provides
positive retention when
mated with the latching
cable connector (page 21).
All headers feature polariza-
tion to help prevent mis-
alignment during mating.
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-1106-0803
South America: 55-11-2103-6000
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-8706-080-208

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