146130-1 TE Connectivity, 146130-1 Datasheet - Page 212

Conn Unshrouded Header HDR 4 POS 2.54mm Solder ST SMD

146130-1

Manufacturer Part Number
146130-1
Description
Conn Unshrouded Header HDR 4 POS 2.54mm Solder ST SMD
Manufacturer
TE Connectivity
Type
Unshrouded Headerr
Datasheet

Specifications of 146130-1

Pitch
2.54 mm
Number Of Rows
2
Number Of Contacts
4
Gender
HDR
Contact Plating
Gold Over Nickel
Termination Method
Solder
Rohs Compliant
NO
Product Type
Connector
Mount Angle
Vertical
Pcb Mount Retention
Without
Surface Mount Compatible
Yes
Board Standoff
Without
Mounting Ears
Without
Mating Connector Lock
Without
Breakaway Header
Yes
Pcb Mounting Orientation
Vertical
Post Size (mm [in])
0.64 [.025]
Mating Post Length (mm [in])
5.84 [0.230]
Panel Mount Retention
Without
Current Rating (a)
3
Insulation Resistance (m?)
5,000
Dielectric Withstanding Voltage (v)
750
Solder Tail Contact Plating
Tin-Lead over Nickel
Header Type
Breakaway
Number Of Positions
4
Centerline (mm [in])
2.54 [0.100]
Row-to-row Spacing (mm [in])
2.54 [0.100]
Selectively Loaded
No
Mount Type
Printed Circuit Board
Contact Plating, Mating Area, Material
Gold (30)
Contact Shape
Square
Contact Base Material
Phosphor Bronze
Housing Material
Thermoplastic - GF
Housing Color
Black
Ul Flammability Rating
UL 94V-0
Rohs/elv Compliance
ELV compliant, 5 of 6 Compliant
Lead Free Solder Processes
Reflow solder capable to 245°C, Reflow solder capable to 260°C
Approved Standards
UL E28476, CSA LR7189
High Temperature Housing
Yes
Temperature Range (°c)
-65 – +125
High Temperature Compatible
Yes
High Speed Serial Data Connector
No
5
212
Crimp Snap-In Receptacles
with Insulation Support
(Standard, Intermediate
and High Pressure)
Material and Finish
Beryllium copper, phosphor bronze or
copper-tin-phosphor bronze (see charts,
on following page), plated as follows:
Plating A — Duplex plated .000030
[0.00076] gold on contact area, .000100-
.000200 [0.00254-0.00508] tin on crimp
area, with entire contact underplated
.000050 [0.00127] nickel
Plating B — Duplex plated .000015
[0.00038] gold on contact area, .000100-
.000200 [0.00254-0.00508] tin on crimp
area, with entire contact underplated
.000050 [0.00127] nickel
Plating D — Selectively plated .000050
[0.00127] gold on contact area, with gold
flash over .000050 [0.00127] nickel on
entire contact
Plating E — Selectively plated .000030
[0.00076] gold on contact area, with gold
flash over .000050 [0.00127] nickel on
entire contact
Plating F — Selectively plated .000015
[0.00038] gold on contact area, with gold
flash over .000050 [0.00127] nickel on
entire contact
Plating G — .000100-.000200
[0.00254-0.00508] tin over .000030
[0.00076] nickel on entire contact
Related Product Data
Housings Used With —
pages 214-220
Performance Characteristics —
page 210
Application Tooling —
pages 270-272
Technical Documents
pages 277, 278
Product Specification
108-25007, 108-25019, 108-25020,
108-25021
Application Specification
114-25003, 114-25016
Catalog 1307819
Revised 8-08
www.tycoelectronics.com
are metric equivalents.
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
AMPMODU Interconnection System
Mod IV Receptacle Contacts
Standard Pressure
Intermediate Pressure
High Pressure
[1.47]
.058
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
[1.73]
.068
[4.19]
.165
Mating Force
16 oz. Max.
20 oz. Max.
9 oz. Max.
A
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-1106-0803
Unmating Force
1.5 oz. Min.
2 oz. Min.
3 oz. Min.
Intermediate Pressure
Standard Pressure
High Pressure
South America: 55-11-2103-6000
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-8706-080-208
A-Gap Dimension
A
A
.013±.002
.008/.014
.008/.014
A

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