146130-8 TE Connectivity, 146130-8 Datasheet - Page 158

Conn Unshrouded Header HDR 18 POS 2.54mm Solder ST SMD

146130-8

Manufacturer Part Number
146130-8
Description
Conn Unshrouded Header HDR 18 POS 2.54mm Solder ST SMD
Manufacturer
TE Connectivity
Type
Unshrouded Headerr
Datasheet

Specifications of 146130-8

Pitch
2.54 mm
Number Of Rows
2
Number Of Contacts
18
Gender
HDR
Contact Plating
Gold Over Nickel
Termination Method
Solder
Product Type
Connector
Mount Angle
Vertical
Pcb Mount Retention
Without
Surface Mount Compatible
Yes
Board Standoff
Without
Mounting Ears
Without
Mating Connector Lock
Without
Breakaway Header
Yes
Pcb Mounting Orientation
Vertical
Post Size (mm [in])
0.64 [.025]
Mating Post Length (mm [in])
5.84 [0.230]
Panel Mount Retention
Without
Current Rating (a)
3
Insulation Resistance (m?)
5,000
Dielectric Withstanding Voltage (v)
750
Solder Tail Contact Plating
Tin-Lead over Nickel
Header Type
Breakaway
Number Of Positions
18
Centerline (mm [in])
2.54 [0.100]
Row-to-row Spacing (mm [in])
2.54 [0.100]
Selectively Loaded
No
Mount Type
Printed Circuit Board
Contact Plating, Mating Area, Material
Gold (30)
Contact Shape
Square
Contact Base Material
Phosphor Bronze
Housing Material
Thermoplastic - GF
Housing Color
Black
Ul Flammability Rating
UL 94V-0
Rohs/elv Compliance
ELV compliant, 5 of 6 Compliant
Lead Free Solder Processes
Reflow solder capable to 245°C, Reflow solder capable to 260°C
Approved Standards
UL E28476, CSA LR7189
High Temperature Housing
Yes
Temperature Range (°c)
-65 – +125
High Temperature Compatible
Yes
High Speed Serial Data Connector
No
5
158
Receptacle Assembly for
Inner Board (With 0.55
[.022] Square Post)
Material and Finish
Housing — Black glass-filled PBT,
94V-0 rated
Contacts — Copper alloy, plated
0.00020 [.000008] gold on contact area
and post mating area, gold flash on
ACTION PIN tail or 0.000070 [.0000027]
tin on solder tail, with entire contact
underplated 0.00130 [.000050] nickel
Application Tooling shown on
page 162.
PC Board Mounting
Dimensions
Catalog 1307819
Revised 8-08
www.tycoelectronics.com
[.000984-.001968]
0.02500-0.05000
plating Copper
0.825
[.032
Finished
hole dia.
Thru hole
±.002
±0.05
]
Land dia.
[.055]
1.4
PCB drill hole
Min.
[.035
0.9
are metric equivalents.
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
±0.025
Board
±.0001
[.062]
Thick
1.6
]
AMPMODU Interconnection System
Receptacle Assemblies with ACTION PIN Posts
(Non-Intermateable with AMPMODU Connectors)
For Inner Board
*Contact area and post mating area: 0.00050 [.000020] min. gold over 0.00130 [.000050] min. nickel plated.
Note: All part numbers are RoHS compliant.
[.300]
7.6
Dimensions
13.4 [.528]
[.469]
Stacking
[.100]
11.9
2.54
[.100]
Pitch
2.54
Y
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
Y
[.100±.004]
Length
[.100]
2.54±0.1
Post
.350
10.9
.429
2.54
8.9
L
Section Y-Y
Pitch
A
B
B
Recommended PC Board Hole Layout
X
X
No. of
Pos.
30
34
40
50
60
26
30
34
40
50
60
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-1106-0803
[.100±.004]
Mating
2.54±0.1
Area
B ±0.1
40.6 [1.598]
45.7 [1.799]
53.3 [2.098]
66.0 [2.598]
78.7 [3.098]
35.6 [1.402]
40.6 [1.598]
45.7 [1.799]
53.3 [2.098]
66.0 [2.598]
78.7 [3.098]
[±.004]
Dimensions (See Note.)
A
ACTION
Area
PIN
35.56 [1.400]
40.64 [1.600]
48.26 [1.900]
60.96 [2.400]
73.66 [2.900]
30.48 [1.200]
35.56 [1.400]
40.64 [1.600]
48.26 [1.900]
60.96 [2.400]
73.66 [2.900]
[.146]
[.020]
0.5
3.7
L
South America: 55-11-2103-6000
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-8706-080-208
B
Section X-X
[.252]
6.4
Dimensions are
millimeters over inches
METRIC
[.100]
2.54
Receptacle
3-173145-2
3-173145-7
3-173145-3
3-173145-1*
3-173145-4
3-173145-5
1-173145-9
2-173145-0
1-173145-0
Assembly
Contact
Part Nos.
Area
173145-7
173145-8
173145-9

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