101800F00000G

Manufacturer Part Number101800F00000G
DescriptionTHERMAL GREASE
ManufacturerAavid Thermalloy
SeriesTherolink 1000
TypeGrease
101800F00000G datasheet
MSDS Material Safety Datasheet
 

Specifications of 101800F00000G

Size / Dimension2 oz TubeLead Free Status / RoHS StatusLead free / RoHS Compliant
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Page 24/116

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SMT
5731
Surface mount heat sink for D-PAK (TO-252) package semiconductors
Surface mount heat sink for D-PAK
(TO-252) package semiconductors
remove the heat indirectly without
contacting the device like traditional
through hole heat sinks. The device
and the heat sink are soldered directly
to a modified drain pad creating a
thermal transfer path from package
tab to the heat sink.
ORDERING INFORMATION
Part Number
Packaging
573100D00010G
13" Reel, 250 per reel
573100D00000G
Bulk, 500 per bag
See page 25 for tape and reel information
5733
Surface mount heat sink for D
Surface mount heat sink for D
2
PAK
(TO-263) package semiconductors
remove the heat indirectly without
contacting the device like traditional
through hole heat sinks. The device
and the heat sink are soldered directly
to a modified drain pad creating a
thermal transfer path from package
tab to the heat sink.
ORDERING INFORMATION
Part Number
Packaging
573300D00010G
13" Reel, 250 per reel
573300D00000G
Bulk, 500 per bag
See page 25 for tape and reel information
7106
Surface mount heat sink for D
Surface mount heat sink for D
2
PAK
(TO-263), power SO-10 (MO-184)
and SO-10 package semiconductors
remove the heat indirectly without
contacting the device like traditional
through hole heat sinks. The device
and the heat sink are soldered directly
to a modified drain pad creating a
thermal transfer path from package
tab to the heat sink.
ORDERING INFORMATION
Part Number
Packaging
7106D/TRG
13" Reel, 200 per reel
7106DG
Bulk, 500 per bag
See page 25 for tape and reel information
AMERICA
24
EUROPE
www.aavidthermalloy.com
Air Velocity—Feet Per Minute
0
200
400
600
800
1000
100
25
80
20
60
15
40
10
20
5
0
0
0.0
0.5
1.0
1.5
2.0
2.5
Heat Dissipated—Watts
2
PAK (TO-263) package semiconductors
Air Velocity—Feet Per Minute
0
200
400
600
800
1000
50
20
40
16
12
30
20
8
4
10
0
0
0.0
0.5
1.0
1.5
2.0
2.5
Heat Dissipated—Watts
2
PAK (TO-263), power SO-10 (MO-184) and SO-10 package semiconductors
Air Velocity—Feet Per Minute
0
200
400
600
800
1000
100
10
80
8
60
6
40
4
20
2
0
0
0
1
2
3
4
5
Heat Dissipated—Watts
USA Tel: +1 (603) 224-9988 email: info@aavid.com
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
8.00
(0.315)
22.86
(0.900)
10.16
8.13
(0.400)
(0.320)
1.3
10.41
(0.05)
(0.410)
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
Refer to Figure A and B on page 26 for board footprint information
12.70
(0.500)
26.16
(1.030)
10.16
7.37
(0.400)
(0.290)
12.70
1.3
(0.500)
(0.05)
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
Refer to Figure A and B on page 26 for board footprint information
5.33
(0.210)
10.92
14.99
(0.430)
(0.590)
25.91
(1.020)
10.16
(0.400)
9.52
(0.375)
7.62
(0.300)
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
Refer to Figure C on page 26 for board footprint information
ASIA
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
14.99
(0.590)