658-45AB Wakefield Thermal Solutions, 658-45AB Datasheet - Page 9
658-45AB
Manufacturer Part Number
658-45AB
Description
HEATSINK CPU 28MM SQBLK W/O TAPE
Manufacturer
Wakefield Thermal Solutions
Series
658r
Datasheet
1.658-60ABT3.pdf
(19 pages)
Specifications of 658-45AB
Height
0.45" (11.43mm)
Color
Black
Package Cooled
Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method
Thermal Tape, Adhesive (Not Included)
Outline
27.94mm x 27.94mm
Power Dissipation @ Temperature Rise
3W @ 50°C
Thermal Resistance @ Forced Air Flow
6.0°C/W @ 200 LFM
Product
Heatsinks
Mounting Style
SMD/SMT
Heatsink Material
Aluminum
Fin Style
Omnidirectional Pin
Dimensions
27.9 mm L x 27.9 mm W x 11.43 mm H
Designed For
BGA, Super BGA, PBGA, FPBGA, PowerPC
Packages Cooled
BGA / LED
Width
27.9mm
Heat Sink Material
Aluminum
Length
27.9mm
Mounting Type
Adhesive
Size
0.450H X 1.100W X 1.100L"
Package / Case
BGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Thermal Resistance @ Natural
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
345-1069
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
658-45ABT4
Manufacturer:
WAK
Quantity:
50
HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs
Designed to fit a .063” thick PCB
electronic package thickness of .110”
See 609 Series for PCB hole layout for clip attachment
DIM.
“A”
619 95 AB 124 D1 S3
2.808
Thermal Interface Material Option
Blank
S5
S6
S3
S4
5
4
3
2
1
0
*Performance is for shrouded conditions. 609-100
will perform better than 609-50 in cases with bypass.
Bergquist Qpad 3
Bergquist Softface
Chomerics T710
Chomerics T443
*
609-100AB
100
None
609-50AB
AIR VELOCITY (LFM)
200
300
400
500