FERRITE CHIP 1500 OHM 500MA 0805

MMZ2012Y152B

Manufacturer Part NumberMMZ2012Y152B
DescriptionFERRITE CHIP 1500 OHM 500MA 0805
ManufacturerTDK Corporation
SeriesMMZ
MMZ2012Y152B datasheet
 


Specifications of MMZ2012Y152B

Package / Case0805 (2012 Metric)Impedance @ Frequency1.5K Ohm @ 100MHz
Current Rating500mADc Resistance (dcr)400.0 mOhm Max
Filter TypeDifferential Mode - SingleNumber Of Lines1
Mounting TypeSurface MountShieldingUnshielded
Test Frequency100 MHzProductChip Ferrite Beads
Impedance1500 OhmsTolerance25 %
Maximum Dc Current500 mAmpsMaximum Dc Resistance0.4 Ohms
Operating Temperature Range- 55 C to + 125 CTermination StyleSMD/SMT
Lead Free Status / RoHS StatusLead free / RoHS CompliantOther names445-1560-2
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Chip Beads(SMD)
For Signal Line
MMZ Series MMZ2012 Type
FEATURES
• Chip bead(impeder), MMZ series offers 4 construction materials.
• Size standardized for use by automatic assembly equipment.
No preferred orientation.
• Either flow or reflow soldering methods can be used due to
electroplating of the terminal electrodes.
• High reliability due to an entirely monolithic structure.
• Closed magnetic circuit structure allows high-density installation
while preventing crosstalk between circuits.
• Low DC resistance structure of electrode prevents wasteful
electric power consumption.
• The products contain no lead and also support lead-free
soldering.
• It is a product conforming to RoHS directive.
APPLICATIONS
Removal of signal line noises of cellular phones, PCs, note PCs,
TVs, TV tuners, STBs, audio players, DVDs, DSCs, DVCs, game
machines, digital photo frames, car navigation system, PNDs, etc.
PRODUCT IDENTIFICATION
MMZ 2012 R 121
A
T
(1)
(2)
(3) (4) (5) (6)
(1) Series name
(2) Dimensions L× W
(3) Material code
(4) Nominal impedance
121:120Ω at 100MHz
(5) Characteristic type
(6) Packaging style
T:Taping
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components. The preheat-
ing temperature should be set so that the temperature difference
between the solder temperature and product temperature does
not exceed 150°C.
• After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
• Do not expose the inductors to stray magnetic fields.
• Avoid static electricity discharge during handling.
• When hand soldering, apply the soldering iron to the printed cir-
cuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
• Please contact our Sales office when your application are considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
• All specifications are subject to change without notice.
Conformity to RoHS Directive
MATERIAL CHARACTERISTICS
R material: For wide frequency applications calling for broad
impedance characteristics.
For digital signal line applications calling requiring
good waveform integrity. Impedance values selected
for effectiveness at 10 to 200MHz.
S material: Standard type that features impedance characteristics
similar to those of a typical ferrite core.
For signal line applications in which the blocking region
is near 100MHz. Impedance values selected for effec-
tiveness at 40 to 300MHz.
Y material: High frequency range type intended for the 100MHz
region and above.
For signal line applications in which the signal fre-
quency is far from the cutoff frequency. Impedance val-
ues selected for effectiveness at 80 to 400MHz.
D material: For applications calling for low insertion loss at low fre-
quencies and sharply increasing impedance at high
frequencies. Designed for high impedance at high fre-
quencies (200 to 500MHz) for signal line applications.
TYPICAL MATERIAL CHARACTERISTICS
2500
2000
Y
1500
1000
S
R
500
0
10
100
Frequency(MHz)
007-02 / 20090921 / e9412_mmz2012.fm
(1/4)
D
1000

MMZ2012Y152B Summary of contents

  • Page 1

    Chip Beads(SMD) For Signal Line MMZ Series MMZ2012 Type FEATURES • Chip bead(impeder), MMZ series offers 4 construction materials. • Size standardized for use by automatic assembly equipment. No preferred orientation. • Either flow or reflow soldering methods can be ...

  • Page 2

    ... MMZ2012R121A MMZ2012R301A MMZ2012R601A Weight: 8mg MMZ2012R102A Dimensions in mm MMZ2012S400A MMZ2012S800A MMZ2012S121A MMZ2012S181A MMZ2012S301A MMZ2012S601A MMZ2012S102A MMZ2012Y150B MMZ2012Y300B MMZ2012Y600B MMZ2012Y121B MMZ2012Y301B MMZ2012Y601B MMZ2012Y102B MMZ2012Y152B MMZ2012Y202B MMZ2012D800B MMZ2012D121B MMZ2012D301B ∗ Test equipment : Test tool 16192A or equivalent Test temperature: 25±10°C MMZ2012R300A 120 100 ...

  • Page 3

    TYPICAL ELECTRICAL CHARACTERISTICS vs. FREQUENCY CHARACTERISTICS MMZ2012R102A 1600 1400 1200 1000 800 Z 600 R 400 X 200 100 1000 10000 Frequency ( MHz ) MMZ2012S121A 300 250 200 150 Z 100 R X ...

  • Page 4

    ... TYPICAL ELECTRICAL CHARACTERISTICS vs. FREQUENCY CHARACTERISTICS MMZ2012Y301B 800 700 600 500 400 Z R 300 200 X 100 100 1000 10000 Frequency ( MHz ) MMZ2012Y152B 1600 1400 1200 Z R 1000 800 600 X 400 200 100 1000 10000 Frequency ( MHz ) MMZ2012D121B 1600 1400 1200 1000 Z R 800 ...