SST39VF1681-70-4I-EKE-T Microchip Technology, SST39VF1681-70-4I-EKE-T Datasheet - Page 29

• Manufacturer Part Number: SST39VF1681-70-4I-EKE-T
• Description: 2.7V To 3.6V 16Mbit Multi-Purpose Flash 48 TSOP 12x20 Mm T/R
• Manufacturer: Microchip Technology

Specifications of SST39VF1681-70-4I-EKE-T

• Format - Memory: FLASH
• Memory Type: FLASH
• Memory Size: 16M (2M x 8)
• Speed: 70ns
• Interface: Parallel
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 48-TFSOP (0.472", 12.0mm Width)
• Architecture: Sector Erase
• Timing Type: Asynchronous
• Interface Type: CFI
• Access Time: 70 ns
• Supply Voltage (max): 3.6 V
• Supply Voltage (min): 2.7 V
• Maximum Operating Current: 9 mA
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

16 Mbit Multi-Purpose Flash Plus
SST39VF1681 / SST39VF1682
TABLE 16: R
©2003 Silicon Storage Technology, Inc.
Silicon Storage Technology, Inc. • 1171 Sonora Court • Sunnyvale, CA 94086 • Telephone [phone] • Fax [phone]
Number
48-
SST P
00
01
02
03
Note:
BALL
ACKAGE
6
5
4
3
2
1
T
A1 CORNER
1. Complies with JEDEC Publication 95, MO-210, variant 'AB-1', although some dimensions may be more stringent.
2. All linear dimensions are in millimeters.
3. Coplanarity: 0.12 mm
4. Ball opening size is 0.38 mm (± 0.05 mm)
•
•
•
•
•
•
HIN
EVISION
-
A B C D E F G H
Initial release
Change product number from 166x to 168x
Added B3K package and associated MPNs (See page 27)
Removed 90 ns Commercial temperature for the EK and EKE packages
2004 Data Book
Updated B3K package diagram
PROFILE
C
ODE
SEATING PLANE
SIDE VIEW
TOP VIEW
8.00 ± 0.20
H
: B3K
ISTORY
, F
INE
-
PITCH
B
0.35 ± 0.05
ALL
www.SuperFlash.com or www.sst.com
6.00 ± 0.20
1.10 ± 0.10
G
RID
A
0.12
Description
RRAY
29
(TFBGA) 6
4.00
0.80
H G F E D C B A
MM X
BOTTOM VIEW
8
MM
5.60
0.80
Preliminary Specifications
A1 CORNER
6
5
4
3
2
1
48-tfbga-B3K-6x8-450mic-4
1mm
0.45 ± 0.05
(48X)
S71243-03-000
May 2003
Sep 2003
Nov 2003
Oct 2003
Date
11/03