M38510/21002BJA QP SEMICONDUCTOR, M38510/21002BJA Datasheet - Page 58

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M38510/21002BJA

Manufacturer Part Number
M38510/21002BJA
Description
Manufacturer
QP SEMICONDUCTOR
Datasheet

Specifications of M38510/21002BJA

Lead Free Status / RoHS Status
Not Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
M38510/21002BJA
Manufacturer:
TI
Quantity:
2
contract or order (see 6.2). When packaging of materiel is to be performed by DoD or in-house contractor personnel,
these personnel need to contact the responsible packaging activity to ascertain packaging requirements. Packaging
requirements are maintained by the Inventory Control Point's packaging activity within the Military Service or Defense
Agency, or within the military service's system command. Packaging data retrieval is available from the managing
Military Department's or Defense Agency's automated packaging files, CD-ROM products, or by contacting the
responsible packaging activity.
mandatory.)
equipment.
are, at the time of award of contract, qualified for inclusion in Qualified Manufacturers List QML-38535 whether or not
such products have actually been so listed by that date. The attention of the contractors is called to these
requirements, and manufacturers are urged to arrange to have the products that they propose to offer to the Federal
Government tested for qualification in order that they may be eligible to be awarded contracts or purchase orders for
the products covered by this specification. Information pertaining to qualification of products may be obtained from
DSCC-VQ, 3990 E. Broad Street, Columbus, Ohio 43218-3990.
5. PACKAGING
5.1 Packaging requirements. For acquisition purposes, the packaging requirements shall be as specified in the
6.
6.1 Intended use. Microcircuits conforming to this specification are intended for logistic support of existing
6.2 Acquisition requirements. Acquisition documents should specify the following:
6.3 Qualification. With respect to products requiring qualification, awards will be made only for products which
a.
b.
c.
d.
e.
f.
g.
h.
i.
j.
k.
NOTES
(This section contains information of a general or explanatory nature which may be helpful, but is not
Title, number, and date of the specification.
PIN and compliance identifier, if applicable (see 1.2).
Requirements for delivery of one copy of the conformance inspection data pertinent to the device
inspection lot to be supplied with each shipment by the device manufacturer, if applicable.
Requirements for certificate of compliance, if applicable.
Requirements for notification of change of product or process to contracting activity in addition to
notification to the qualifying activity, if applicable.
Requirements for failure analysis (including required test condition of method 5003 of MIL-STD-883),
corrective action, and reporting of results, if applicable.
Requirements for product assurance options.
Requirements for special lead lengths, or lead forming, if applicable.
requirements will not apply to direct purchase by or direct shipment to the Government.
Requirement for programming the device, including processing option. The device may be programmed
pre- or post-burn-in, if applicable.
Requirements for "JAN" marking.
Packaging Requirements (see 5.1)
MIL-M-38510/210E
58
Unless otherwise specified, these

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