TCD1201DG Toshiba, TCD1201DG Datasheet
TCD1201DG
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TCD1201DG Summary of contents
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... TOSHIBA CCD LINEAR IMAGE SENSOR CCD(Charge Coupled Device) Preliminary The TCD1201DG is a high sensitive and low dark current 2048−elements linear image sensor. The sensor can be used for POS handscanner. The device is operated by only 5V power supply, and mounted in 22−pin cerdip package with hermetic sealed optical glass window ...
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... TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or others. • The information contained herein is subject to change without notice. TCD1201DG 000707EBA2 2004-02-09 2/12 ...
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... O DR ― 1.5 DOS |V −V | ― OS DOS ∆ χ × 100 % χ ∆ χ is the maximum deviation from SAT ⋅ TCD1201DG = 0.5MHz 1MHz, φ RS TYP. MAX UNIT NOTE lx·s (Note 2) ― (Note 3) 0.8 ― V (Note 4) 0.01 ― lx·s (Note (Note ...
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... V SAT Note 7: Definition MDK V is proportional to t MDK INT So the shorter t condition makes wider DR value. INT Note 8: DC signal output voltage and DC compensation output voltage are defined as follows: (Integration Time). TCD1201DG 2004-02-09 4/12 ...
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... Shift Gate Capacitance Reset Gate Capacitance SYMBOL “H” Level “L” Level “H” Level “L” Level “H” Level “L” Level (Ta = 25°C) SYMBOL C C TCD1201DG MIN TYP. MAX 4.5 5.0 5.5 V φ 0 0.2 0.5 4.5 5.0 5 ...
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... TCD1201DG 2004-02-09 6/12 ...
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... Pulse Timing of RS and BT Pulse Timing φ φ Video Data Delay Time Note & 2 pulse cross point could't be kept over 2.5V, it should be 1.5V and t19 and t20 should be 60ns. φ φ TCD1201DG SYMBOL MIN TYP. MAX t1 0 100 ― t5 2000 3000 ― ...
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... TYPICAL DRIVE CIRCUIT TCD1201DG TCD1201DG 2004-02-09 10/12 ...
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... Soldering by the solder flow method cannot be guaranteed because this method may have deleterious effects on prevention of window glass soiling and heat resistance. Using a soldering iron, complete soldering within ten seconds for lead temperatures 260°C, or within three seconds for lead temperatures 350°C. TCD1201DG 2004-02-09 11/12 ...
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... PACKAGE DIMENSIONS 6.46±0.8 8.1TYP Note 1: No. 1 SENSOR ELEMENT (S1) TO EDGE OF PACKAGE. Note 2: TOP OF CHIP TO BOTTOM OF PACKAGE. Note 3: GLASS THICKNES (n = 1.5) Weight: (3.5g (Typ.)) 28.6(14umX2048) TCD1201DG 2004-02-09 12/12 ...