LFXP3C-4T144C LATTICE SEMICONDUCTOR, LFXP3C-4T144C Datasheet - Page 25

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LFXP3C-4T144C

Manufacturer Part Number
LFXP3C-4T144C
Description
FPGA LatticeXP Family 3000 Cells 360MHz 130nm (CMOS) Technology 1.8V/2.5V/3.3V 144-Pin TQFP Tray
Manufacturer
LATTICE SEMICONDUCTOR
Datasheet

Specifications of LFXP3C-4T144C

Package
144TQFP
Family Name
LatticeXP
Device Logic Units
3000
Maximum Internal Frequency
360 MHz
Typical Operating Supply Voltage
1.8|2.5|3.3 V
Maximum Number Of User I/os
100
Ram Bits
55296
Re-programmability Support
Yes

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LFXP3C-4T144C
Manufacturer:
Lattice Semiconductor Corporation
Quantity:
10 000
Architecture
Lattice Semiconductor
LatticeXP Family Data Sheet
Polarity Control Logic
In a typical DDR Memory interface design, the phase relation between the incoming delayed DQS strobe and the
internal system Clock (during the READ cycle) is unknown.
The LatticeXP family contains dedicated circuits to transfer data between these domains. To prevent setup and
hold violations at the domain transfer between DQS (delayed) and the system Clock a clock polarity selector is
used. This changes the edge on which the data is registered in the synchronizing registers in the input register
block. This requires evaluation at the start of the each READ cycle for the correct clock polarity.
Prior to the READ operation in DDR memories DQS is in tristate (pulled by termination). The DDR memory device
drives DQS low at the start of the preamble state. A dedicated circuit detects this transition. This signal is used to
control the polarity of the clock to the synchronizing registers.
sysIO Buffer
Each I/O is associated with a flexible buffer referred to as a sysIO buffer. These buffers are arranged around the
periphery of the device in eight groups referred to as Banks. The sysIO buffers allow users to implement the wide
variety of standards that are found in today’s systems including LVCMOS, SSTL, HSTL, LVDS and LVPECL.
sysIO Buffer Banks
LatticeXP devices have eight sysIO buffer banks; each is capable of supporting multiple I/O standards. Each sysIO
bank has its own I/O supply voltage (V
), and two voltage references V
and V
resources allowing each
CCIO
REF1
REF2
bank to be completely independent from each other. Figure 2-28 shows the eight banks and their associated sup-
plies.
In the LatticeXP devices, single-ended output buffers and ratioed input buffers (LVTTL, LVCMOS, PCI and PCI-X) are
powered using V
. LVTTL, LVCMOS33, LVCMOS25 and LVCMOS12 can also be set as a fixed threshold input
CCIO
independent of V
In addition to the bank V
supplies, the LatticeXP devices have a V
core logic power sup-
CCIO.
CCIO
CC
ply, and a V
supply that power all differential and referenced buffers.
CCAUX
Each bank can support up to two separate VREF voltages, VREF1 and VREF2 that set the threshold for the refer-
enced input buffers. In the LatticeXP devices, a dedicated pin in a bank can be configured to be a reference voltage
supply pin. Each I/O is individually configurable based on the bank’s supply and reference voltages.
2-22

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