AD9513BCPZ Analog Devices Inc, AD9513BCPZ Datasheet - Page 11

• Manufacturer Part Number: AD9513BCPZ
• Description: IC CLOCK DIST 3OUT PLL 32LFCSP
• Manufacturer: Analog Devices Inc
• Type: Fanout Buffer (Distribution), Dividerr

Specifications of AD9513BCPZ

• Number Of Circuits: 1
• Ratio - Input:output: 1:3
• Differential - Input:output: Yes/Yes
• Input: Differential
• Output: CMOS, LVDS
• Frequency - Max: 800MHz
• Voltage - Supply: 3.135 V ~ 3.465 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 32-LFCSP
• Frequency-max: 800MHz
• No. Of Multipliers / Dividers: 3
• No. Of Amplifiers: 4
• Supply Voltage Range: 3.135V To 3.465V
• Slew Rate: 1V/ns
• Operating Temperature Range: -40°C To +85°C
• Digital Ic Case Style: LFCSP
• Package: 32LFCSP EP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AD9513/PCBZ - BOARD EVAL CLOCK 3CH AD9513
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

ABSOLUTE MAXIMUM RATINGS
Table 8.
Parameter or Pin
VS
RSET
CLK
CLK
OUT0, OUT1, OUT2
FUNCTION
STATUS
Junction Temperature
Storage Temperature
Lead Temperature (10 sec)
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
1
With
Respect
to
GND
GND
GND
CLKB
GND
GND
GND
Min
−0.3
−0.3
−0.3
−1.2
−0.3
−0.3
−0.3
−65
Max
+3.6
V
V
+1.2
V
V
V
150
+150
300
S
S
S
S
S
+ 0.3
+ 0.3
+ 0.3
+ 0.3
+ 0.3
Unit
V
V
V
V
V
V
V
°C
°C
°C
Rev. 0 | Page 11 of 28
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to
absolute maximum ratings for extended periods may affect
device reliability.
Thermal Resistance
32-Lead LFCSP
1
2
3
THERMAL CHARACTERISTICS
See Thermal Characteristics for θ
Thermal impedance measurements were taken on a 4-layer board in still air
in accordance with EIA/JESD51-7.
The external pad of this package must be soldered to adequate copper land
on board.
θ
JA
= 36.6°C/W
3
JA
.
2
AD9513