MC100EP11MNR4G ON Semiconductor, MC100EP11MNR4G Datasheet
MC100EP11MNR4G
Specifications of MC100EP11MNR4G
Related parts for MC100EP11MNR4G
MC100EP11MNR4G Summary of contents
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MC10EP11, MC100EP11 3.3V / 5V ECL 1:2 Differential Fanout Buffer Description The MC10/100EP11 is a differential 1:2 fanout buffer. The device is pin and functionally equivalent to the LVEL11 device. With AC performance much faster than the LVEL11 device, the EP11 ...
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Figure 1. 8−Lead Pinout (Top View) and Logic Diagram Table 2. ATTRIBUTES Internal Input Pulldown Resistor Internal Input Pullup Resistor ESD Protection Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1) Flammability ...
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Table 3. MAXIMUM RATINGS Symbol Parameter V PECL Mode Power Supply CC V NECL Mode Power Supply EE V PECL Mode Input Voltage I NECL Mode Input Voltage I Output Current out T Operating Temperature Range A T Storage Temperature ...
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Table 5. 10EP DC CHARACTERISTICS, PECL Symbol Characteristic I Negative Power Supply Current EE V Output HIGH Voltage (Note Output LOW Voltage (Note Input HIGH Voltage (Single−Ended Input LOW Voltage (Single−Ended) IL ...
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Table 7. 100EP DC CHARACTERISTICS, PECL Symbol Characteristic I Negative Power Supply Current EE V Output HIGH Voltage (Note 13 Output LOW Voltage (Note 13 Input HIGH Voltage (Single−Ended Input LOW Voltage (Single−Ended) IL ...
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Table 9. 100EP DC CHARACTERISTICS, NECL Symbol Characteristic I Negative Power Supply Current EE V Output HIGH Voltage (Note 19 Output LOW Voltage (Note 19 Input HIGH Voltage (Single−Ended Input LOW Voltage (Single−Ended) IL ...
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900 800 700 600 500 400 300 200 É É É É É É É É É É É É É É É É É É 100 É É É É É É É É É É É É É ...
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Driver Device Figure 4. Typical Termination for Output Driver and Device Evaluation (See Application Note AND8020/D − Termination of ECL Logic Devices.) Resource Reference of Application Notes AN1405/D ...
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... MC100EP11DR2 MC100EP11DR2G MC100EP11DT MC100EP11DTG MC100EP11DGH MC100EP11DR2GH MC100EP11DTR2 MC100EP11DTR2G MC100EP11MNR4G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Package SOIC−8 SOIC−8 (Pb−Free) SOIC−8 SOIC−8 (Pb− ...
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... G C SEATING PLANE −Z− 0.25 (0.010 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. PACKAGE DIMENSIONS SOIC−8 NB CASE 751−07 ISSUE 0.10 (0.004 SOLDERING FOOTPRINT* 1 ...
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K 8x REF 0.10 (0.004) 0.15 (0.006 L −U− PIN 1 IDENT 0.15 (0.006 −V− C 0.10 (0.004) D −T− G SEATING PLANE PACKAGE DIMENSIONS TSSOP−8 ...
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... Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303− ...