NB7HQ14MMNHTBG ON Semiconductor, NB7HQ14MMNHTBG Datasheet - Page 10

• Manufacturer Part Number: NB7HQ14MMNHTBG
• Description: IC BUFFER FANOUT EQUALIZER 16QFN
• Manufacturer: ON Semiconductor
• Series: GigaComm™r
• Type: Fanout Buffer (Distribution), Multiplexer , Datar

Specifications of NB7HQ14MMNHTBG

• Number Of Circuits: 1
• Ratio - Input:output: 1:4
• Differential - Input:output: Yes/Yes
• Input: CML, LVDS, LVPECL
• Output: CML
• Frequency - Max: 7GHz
• Voltage - Supply: 2.375 V ~ 2.625 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-TFQFN Exposed Pad
• Frequency-max: 7GHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

PUBLICATION ORDERING INFORMATION
GigaComm is a trademark of Semiconductor Components Industries, LLC (SCILLC).
LITERATURE FULFILLMENT:
16 X
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ON Semiconductor and
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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0.10 C
0.05 C
NOTE 5
16X
16X
LOCATION
0.10 C
0.08 C
0.15 C
K
L
PIN 1
0.15 C
NOTE 3
A B
DETAIL A
16X
Ç Ç Ç
Ç Ç Ç
b
4
1
DETAIL B
16
BOTTOM VIEW
SIDE VIEW
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
TOP VIEW
5
D2
D
13
8
(A3)
e
12
9
EXPOSED PAD
A1
e
A
B
E
E2
A
EXPOSED Cu
N. American Technical Support: 800−282−9855 Toll Free
Europe, Middle East and Africa Technical Support:
Japan Customer Focus Center
PACKAGE DIMENSIONS
USA/Canada
Phone: [phone]
Phone: 81−3−5773−3850
C
SEATING
PLANE
L1
http://onsemi.com
CASE 485G−01
É É É É
É É
16 PIN QFN
ISSUE D
ALTERNATE TERMINAL
CONSTRUCTIONS
CONSTRUCTIONS
10
DETAIL B
MOLD CMPD
ALTERNATE
DETAIL A
*For additional information on our Pb−Free strategy and soldering
L
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
0.575
0.022
0.128
3.25
A1
É É É É
Ç Ç
L
SOLDERING FOOTPRINT*
A3
0.012
0.30
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
4. COPLANARITY APPLIES TO THE EXPOSED
5. L
0.128
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
3.25
ASME Y14.5M, 1994.
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
PAD AS WELL AS THE TERMINALS.
MINIMUM SPACING BETWEEN LEAD TIP
AND FLAG
DIM
A1
A3
D2
max
E2
L1
A
D
E
K
b
e
L
CONDITION CAN NOT VIOLATE 0.2 MM
MILLIMETERS
MIN
0.80
0.00
0.18
1.65
1.65
0.30
0.00
0.20 REF
3.00 BSC
3.00 BSC
0.50 BSC
0.18 TYP
0.50
0.02
MAX
1.00
0.05
0.30
1.85
1.85
0.50
0.15
SCALE 10:1
EXPOSED PAD
0.059
1.50
0.012
0.30
NB7L14M/D
inches
mm