MC100EP809FAG ON Semiconductor, MC100EP809FAG Datasheet
MC100EP809FAG
Specifications of MC100EP809FAG
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MC100EP809FAG Summary of contents
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MC100EP809 3.3V 1:9 Differential HSTL/PECL/LVDS to HSTL Clock Driver with LVTTL Clock Select and Enable Description The MC100EP809 is a low skew 1−to−9 differential clock driver, designed with clock distribution in mind, accepting two clock sources into an input multiplexer. The ...
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V CCI HSTL_CLK HSTL_CLK CLK_SEL MC100EP809 LVPECL_CLK LVPECL_CLK GND OE All and GND pins must be externally connected to CCI CCO appropriate Power Supply to guarantee proper operation (V Figure 1. 32−Lead LQFP Pinout (Top View) ...
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Table 1. PIN DESCRIPTION PIN FUNCTION HSTL_CLK*, HSTL or LVDS Differential Inputs HSTL_CLK** LVPECL_CLK*, LVPECL or LVDS Differential Inputs LVPECL_CLK** CLK_SEL** LVCMOS/LVTTL Input CLK Select OE** LVCMOS/LVTTL Output Enable Q0 − Q8, HSTL Differential Outputs Q0 − Positive ...
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Table 4. MAXIMUM RATINGS Symbol Parameter V Core Power Supply CC1 V HSTL Output Power Supply CC0 V Input Voltage I I Output Current out T Operating Temperature Range A T Storage Temperature Range stg Thermal Resistance (Junction−to−Ambient ...
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Table 6. LVTTL/LVCMOS DC CHARACTERISTICS Symbol Characteristic V Input HIGH Voltage IH V Input LOW Voltage IL I Input HIGH Current IH I Input LOW Current IL NOTE: Device will meet the specifications after thermal equilibrium has been established when ...
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Table 8. AC CHARACTERISTICS V CCI Symbol Characteristic V Differential Output Voltage f Opp out (Figure 4) f out f out t Propagation Delay (Differential Configura- PLH t tion) LVPECL_CLK to Q PHL HSTL_CLK Within−Device Skew (Note ...
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V V IHCMR PP Figure 5. LVPECL Differential Input Levels HSTL OUTPUT Q Figure 7. HSTL Output Termination and AC Test Reference *Must be CLK/CLK common mode voltage: ((V Figure 8. Single−Ended CLK/CLK Input Configuration CLK CLK ...
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... ORDERING INFORMATION Device MC100EP809FA MC100EP809FAG MC100EP809FAR2 MC100EP809FAR2G MC100EP809MNG MC100EP809MNR4G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Resource Reference of Application Notes AN1405/D AN1406/D AN1503/D AN1504/D AN1568/D AN1672/D AND8001/D − ...
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−T− DETAIL −Z− −AB− −AC− SEATING PLANE 0.10 (0.004) AC PACKAGE DIMENSIONS 32 LEAD LQFP CASE 873A−02 ISSUE C 4X 0.20 (0.008) AB T-U Z −U− ...
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... X 0.28 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81− ...