W181-01G Cypress Semiconductor Corp, W181-01G Datasheet - Page 8

CLOCK EMI REDUCTION SSCG 8-SOIC

W181-01G

Manufacturer Part Number
W181-01G
Description
CLOCK EMI REDUCTION SSCG 8-SOIC
Manufacturer
Cypress Semiconductor Corp
Series
Premis™r
Type
Clock/Frequency Synthesizer, Spread Spectrum Clock Generatorr
Datasheet

Specifications of W181-01G

Pll
Yes
Input
Clock, Crystal
Output
CMOS
Number Of Circuits
1
Ratio - Input:output
1:1
Differential - Input:output
No/No
Frequency - Max
75MHz
Divider/multiplier
Yes/No
Voltage - Supply
3.135 V ~ 5.5 V
Operating Temperature
0°C ~ 70°C
Mounting Type
Surface Mount
Package / Case
8-SOIC (3.9mm Width)
Frequency-max
75MHz
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
428-1395

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
W181-01G
Manufacturer:
TEXAS
Quantity:
224
Part Number:
W181-01G
Manufacturer:
CYPRESS/赛普拉斯
Quantity:
20 000
Part Number:
W181-01GI
Manufacturer:
CYPRESS/赛普拉斯
Quantity:
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Part Number:
W181-01GT
Manufacturer:
PTC
Quantity:
20 000
Package Drawing and Dimension
PREMIS is a trademark of Cypress Semiconductor. All product and company names mentioned in this document are the trade-
marks of their respective holders.
Document #: 38-07152 Rev. *D
© Cypress Semiconductor Corporation, 2003. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress Semiconductor product. Nor does it convey or imply any license under patent or other rights. Cypress Semiconductor does not authorize
its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
Semiconductor products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress Semiconductor against all charges.
0.85[0.033]
0.95[0.037]
0.65[0.025]
BSC.
0.050[1.270]
BSC
4.90[0.193]
5.10[0.200]
4
5
8 Lead (150 Mil) SOIC - S08
0.189[4.800]
0.196[4.978]
14-Lead Thin Shrunk Small Outline Package (4.40-mm Body) Z14
0.19[0.007]
0.30[0.012]
14
1
0.0138[0.350]
0.0192[0.487]
4.30[0.169]
4.50[0.177]
1
8
0.05[0.002]
0.15[0.006]
0.004[0.102]
0.0098[0.249]
0.150[3.810]
0.157[3.987]
6.25[0.246]
6.50[0.256]
PIN 1 ID
0.061[1.549]
0.068[1.727]
PIN 1 ID
8-lead (150-Mil) SOIC S8
1.10[0.043] MAX.
0.230[5.842]
0.244[6.197]
SEATING
PLANE
0.004[0.102]
0.076[0.003]
SEATING PLANE
0°~8°
GAUGE
PLANE
2. PIN 1 ID IS OPTIONAL,
1. DIMENSIONS IN INCHES[MM] MIN.
3. REFERENCE JEDEC MS-012
4. PACKAGE WEIGHT 0.07gms
DIMENSIONS IN MM(INCHES)
0.25[0.010]
ROUND ON SINGLE LEADFRAME
RECTANGULAR ON MATRIX LEADFRAME
BSC
S08.15 STANDARD PKG.
SZ08.15 LEAD FREE PKG.
0°-8°
0.016[0.406]
0.035[0.889]
PART #
0.50[0.020]
0.70[0.027]
0.010[0.254]
0.016[0.406]
MAX.
51-85117-*A
51-85066-*C
X 45°
0.0075[0.190]
0.0098[0.249]
0.09[[0.003]
0.20[0.008]
Page 8 of 9
W181

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