MCP3304-CI/SL Microchip Technology, MCP3304-CI/SL Datasheet - Page 21

IC ADC 13BIT 2.7V 4CH SPI 16SOIC

MCP3304-CI/SL

Manufacturer Part Number
MCP3304-CI/SL
Description
IC ADC 13BIT 2.7V 4CH SPI 16SOIC
Manufacturer
Microchip Technology
Datasheets

Specifications of MCP3304-CI/SL

Package / Case
16-SOIC (0.154", 3.90mm Width)
Number Of Bits
13
Sampling Rate (per Second)
100k
Data Interface
Serial, SPI™
Number Of Converters
1
Voltage Supply Source
Single Supply
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Architecture
SAR
Conversion Rate
100 KSPs
Resolution
12 bit
Input Type
Voltage
Snr
80.02 dB
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
MCP3304CI/SL

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MCP3304-CI/SL
Manufacturer:
MICROCHIP
Quantity:
12 000
Part Number:
MCP3304-CI/SL
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
6.7
The MCP3302/04 devices provide both digital and ana-
log ground connections to provide another means of
noise reduction. As shown in Figure 6-11, the analog
and digital circuitry are separated internal to the device.
This reduces noise from the digital portion of the device
being coupled into the analog portion of the device. The
two grounds are connected internally through the sub-
strate which has a resistance of 5 -10 .
If no ground plane is utilized, then both grounds must
be connected to V
available, both digital and analog ground pins should
be connected to the analog ground plane. If both an
analog and a digital ground plane are available, both
the digital and the analog ground pins should be con-
nected to the analog ground plane, as shown in
Figure 6-11. Following these steps will reduce the
amount of digital noise from the rest of the board being
coupled into the A/D Converter.
FIGURE 6-11:
Digital Ground Pins.
2002 Microchip Technology Inc.
Utilizing the Digital and Analog
Ground Pins
Digital Side
-SPI Interface
-Shift Register
-Control Logic
DGND
SS
Analog Ground Plane
on the board. If a ground plane is
MCP3302/04
Substrate
V
5 - 10
Separation of Analog and
DD
Analog Side
-Sample Cap
-Capacitor Array
-Comparator
AGND
0.1 µF
MCP3302/04
DS21697B-page 21

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