6450128-2 TE Connectivity, 6450128-2 Datasheet - Page 4

• Manufacturer Part Number: 6450128-2
• Description: MBXL R/A HDR STR 2P+24S+2P
• Manufacturer: TE Connectivity

Specifications of 6450128-2

• Product Series: XL
• Connector Type: Header
• Mount Angle: Right Angle
• Termination Style: Solder
• Mating Type: Squeeze-to-Release
• Pcb Mount Retention: With
• Guides: With
• Voltage Rating (signal) (vac): 60
• Voltage Rating (power) (vdc): 200
• Termination Post Length (mm [in]): 3.43 [0.135]
• Sequencing: No
• Pcb Mount Retention Type: Retention Clip/Post
• Connector Configuration Orientation: Left-to-Right
• Centerline, Dc Module (mm [in]): 6.35 [0.250]
• Centerline, Matrix (mm [in]): 2.54 x 2.54 [.100 x .100]
• Contact Type: Pin
• Contact Material (power): High Conductivity Copper
• Contact Material (signal): Copper Alloy
• Contact Plating, Mating Area, Material: Gold (30)
• Connector Style: Plug
• Housing Material: High Temperature Thermoplastic
• Total Number Of Dc Power: 4
• Total Number Of Signal: 24
• Connector Contact Configuration (no. Of Pos./type): 2/DC Power, 24/Signal, 2/DC Power
• Rohs/elv Compliance: RoHS compliant, ELV compliant
• Lead Free Solder Processes: Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder capable to 265°C
• Rohs/elv Compliance History: Always was RoHS compliant
• Application Use: Cable-to-Board

Rev C
Mechanical shock.
Durability.
Mating force.
Unmating force.
Compliant pin insertion.
Radial hole distortion.
Compliant pin retention.
Component heat resistance to
wave soldering.
Solderability dip test.
Thermal shock.
Test Description
No discontinuities of 1 microsecond
or longer duration.
See Note.
See Note.
9 N [2 lbf] maximum for power
contact.
Average mating force for signal
contacts shall be less than 1.7 N [6
ozf] per contact.
2.2 N [8 ozf] minimum per power
contact.
0.2 N [.7 ozf] minimum per signal
contact.
111.2 N [25 lbf] maximum per pin.
0.070 mm [.00276 in] maximum
radial distortion.
0.008 mm [.00032 in] minimum
copper hole wall remaining.
6.7 N [1.5 lbf] minimum per pin.
See Note.
Solderable area shall have a
minimum of 95% solder coverage.
See Note.
See Note.
Figure 3 (continued)
ENVIRONMENTAL
Requirement
EIA-364-27, Method A.
Subject mated specimens to 50 G's
half-sine shock pulses of 11
milliseconds duration. Three
shocks in each direction applied
along 3 mutually perpendicular
planes, 18 total shocks.
EIA-364-9.
Mate and unmate specimens for
250 cycles at a maximum rate of
500 cycles per hour.
EIA-364-13.
Measure force necessary to mate
specimens at a maximum rate of
12.7 mm [.5 in] per minute.
EIA-364-13.
Measure force necessary to
unmate specimens at a maximum
rate of 12.7 mm [.5 in] per minute.
TE Spec. 109-41.
Measure force necessary to
correctly apply a specimen to a
printed circuit board at a maximum
rate of 12.7 mm [.5 in] per minute.
TE Spec. 109-136.
Measure at 0.2 to 0.5 mm [.008 to
.020 in] depth.
TE Spec 109-30-1.
Measure force necessary to
remove a correctly applied
specimen from its printed circuit
board at a maximum rate of 12.7
mm [.5 in] per minute.
TE Spec. 109-202, Condition B.
TE Spec. 109-11-11, Test Method
A.
EIA-364-32.
Subject mated specimens to 36
cycles between -20 and 105° C.
Procedure
108-1973
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