MCP4251-103E/SL Microchip Technology, MCP4251-103E/SL Datasheet - Page 70

IC DGTL POT 10K 2CH 14SOIC

MCP4251-103E/SL

Manufacturer Part Number
MCP4251-103E/SL
Description
IC DGTL POT 10K 2CH 14SOIC
Manufacturer
Microchip Technology
Datasheets

Specifications of MCP4251-103E/SL

Package / Case
14-SOIC (3.9mm Width), 14-SOL
Taps
257
Resistance (ohms)
10K
Number Of Circuits
2
Temperature Coefficient
150 ppm/°C Typical
Memory Type
Volatile
Interface
SPI Serial
Voltage - Supply
1.8 V ~ 5.5 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Resistance In Ohms
10K
Number Of Pots
Dual
Taps Per Pot
256
Resistance
10 KOhms
Wiper Memory
Volatile
Digital Interface
Serial (SPI)
Operating Supply Voltage
2.5 V or 3.3 V or 5 V
Supply Current
1 mA
Maximum Operating Temperature
+ 125 C
Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT
Supply Voltage (max)
5.5 V
Supply Voltage (min)
1.8 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
MCP4251-103-E/SL
MCP4251-103-E/SL

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MCP4251-103E/SL
Manufacturer:
AD
Quantity:
2 000
Part Number:
MCP4251-103E/SL
Manufacturer:
Microchip Technology
Quantity:
1 821
Part Number:
MCP4251-103E/SL
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
MCP413X/415X/423X/425X
8-Lead Plastic Small Outline (SN) – Narrow, 3.90 mm Body [SOIC]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
DS22060A-page 70
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Chamfer (optional)
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
NOTE 1
A
A1
§
N
1
2
D
b
3
e
Dimension Limits
A2
E1
E
Units
A2
A1
E1
φ
L1
N
A
E
D
α
e
h
L
φ
c
b
β
1.25
0.10
0.25
0.40
0.17
0.31
MIN
h
L
L1
MILLIMETERS
h
1.27 BSC
6.00 BSC
3.90 BSC
4.90 BSC
1.04 REF
NOM
8
Microchip Technology Drawing C04-057B
α
β
© 2007 Microchip Technology Inc.
MAX
1.75
0.25
0.50
1.27
0.25
0.51
15°
15°
c

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