MCP4251-103E/SL Microchip Technology, MCP4251-103E/SL Datasheet - Page 75

IC DGTL POT 10K 2CH 14SOIC

MCP4251-103E/SL

Manufacturer Part Number
MCP4251-103E/SL
Description
IC DGTL POT 10K 2CH 14SOIC
Manufacturer
Microchip Technology
Datasheets

Specifications of MCP4251-103E/SL

Package / Case
14-SOIC (3.9mm Width), 14-SOL
Taps
257
Resistance (ohms)
10K
Number Of Circuits
2
Temperature Coefficient
150 ppm/°C Typical
Memory Type
Volatile
Interface
SPI Serial
Voltage - Supply
1.8 V ~ 5.5 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Resistance In Ohms
10K
Number Of Pots
Dual
Taps Per Pot
256
Resistance
10 KOhms
Wiper Memory
Volatile
Digital Interface
Serial (SPI)
Operating Supply Voltage
2.5 V or 3.3 V or 5 V
Supply Current
1 mA
Maximum Operating Temperature
+ 125 C
Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT
Supply Voltage (max)
5.5 V
Supply Voltage (min)
1.8 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
MCP4251-103-E/SL
MCP4251-103-E/SL

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MCP4251-103E/SL
Manufacturer:
AD
Quantity:
2 000
Part Number:
MCP4251-103E/SL
Manufacturer:
Microchip Technology
Quantity:
1 821
Part Number:
MCP4251-103E/SL
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
© 2007 Microchip Technology Inc.
14-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm Body [TSSOP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
NOTE 1
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
A
A1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Molded Package Length
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
N
1 2
b
D
Dimension Limits
MCP413X/415X/423X/425X
e
E1
A2
E
Units
c
A2
A1
E1
L1
N
A
E
D
e
L
φ
c
b
L1
0.80
0.05
4.30
4.90
0.45
0.09
0.19
MIN
MILLIMETERS
0.65 BSC
6.40 BSC
1.00 REF
NOM
1.00
4.40
5.00
0.60
14
Microchip Technology Drawing C04-087B
MAX
1.20
1.05
0.15
4.50
5.10
0.75
0.20
0.30
DS22060A-page 75
φ
L

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