XC3S2000-5FGG676C Xilinx Inc, XC3S2000-5FGG676C Datasheet - Page 193

• Manufacturer Part Number: XC3S2000-5FGG676C
• Description: SPARTAN-3A FPGA 2M 676-FBGA
• Manufacturer: Xilinx Inc
• Series: Spartan™-3r

Specifications of XC3S2000-5FGG676C

• Total Ram Bits: 737280
• Number Of Logic Elements/cells: 46080
• Number Of Labs/clbs: 5120
• Number Of I /o: 489
• Number Of Gates: 2000000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C
• Package / Case: 676-BBGA
• No. Of Logic Blocks: 5120
• No. Of Gates: 2000000
• No. Of Macrocells: 46080
• Family Type: Spartan-3
• No. Of Speed Grades: 5
• No. Of I/o's: 489
• Clock: RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Table 106: FG900 Package Pinout (Continued)
Table 107: User I/Os Per Bank for XC3S2000 in FG900 Package
Table 108: User I/Os Per Bank for XC3S4000 and XC3S5000 in FG900 Package
DS099-4 (v2.5) December 4, 2009
Product Specification
VCCAUX PROG_B
VCCAUX TCK
VCCAUX TDI
VCCAUX TDO
VCCAUX TMS
Bank
Bottom
Bottom
Edge
Edge
Right
Right
Left
Left
Top
Top
R
XC3S2000
Pin Name
Bank
Bank
I/O
I/O
0
1
2
3
4
5
6
7
0
1
2
3
4
5
6
7
PROG_B
TCK
TDI
TDO
TMS
XC3S4000
XC3S5000
Pin Name
Maximum
Maximum
I/O
I/O
71
71
69
71
72
71
69
71
79
79
79
79
80
79
79
79
Number
FG900
C28
B28
A28
Pin
C3
B3
CONFIG
I/O
I/O
62
62
61
62
57
55
60
62
70
70
71
70
65
63
70
70
JTAG
JTAG
JTAG
JTAG
Type
www.xilinx.com
User I/Os by Bank
Table 107
tributed between the eight I/O banks for the XC3S2000 in
the FG900 package. Similarly,
available user-I/O pins are distributed between the eight I/O
banks for the XC3S4000 and XC3S5000 in the FG900
package.
DUAL
DUAL
0
0
0
0
6
6
0
0
0
0
0
0
6
6
0
0
All Possible I/O Pins by Type
All Possible I/O Pins by Type
indicates how the available user-I/O pins are dis-
Spartan-3 FPGA Family: Pinout Descriptions
DCI
DCI
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
VREF
VREF
Table 108
5
5
6
7
5
6
7
7
5
5
6
7
5
6
7
7
shows how the
GCLK
GCLK
2
2
0
0
2
2
0
0
2
2
0
0
2
2
0
0
193