AT40K40-2BGC Atmel, AT40K40-2BGC Datasheet - Page 59

• Manufacturer Part Number: AT40K40-2BGC
• Description: IC FPGA 2304 CELL 352-BGA
• Manufacturer: Atmel
• Series: AT40K/KLVr

Specifications of AT40K40-2BGC

• Number Of Logic Elements/cells: 2304
• Total Ram Bits: 18432
• Number Of I /o: 289
• Number Of Gates: 50000
• Voltage - Supply: 4.75 V ~ 5.25 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 352-LBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Number Of Labs/clbs: -
• Other names: AT40K402BGC

100T1 – TQFP
0896C–FPGA–04/02
Notes: 1. This drawing is for general information only. Refer to JEDEC Drawing MO-153, Variation AA, for proper dimensions, tolerances,
2. The top package body size may be smaller than the bottom package size by as much as 0.15 mm.
3. Dimensions D1 and E1 do not include mold protrusions. Allowable protrusion is 0.25 mm per side. D1 and E1 are maximum plastic
4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall not cause the lead width to exceed the maximum
5. These dimensions apply to the flat section of the lead between 0.10 mm and 0.25 mm from the lead tip.
6. A1 is defined as the distance from the seating place to the lowest point on the package body.
e
datums, etc.
body size dimensions, including mold mismatch.
b dimension by more than 0.08 mm. Dambar cannot be located on the lower radius or the foot. Minimum space between protrusion and
an adjacent lead is 0.07 mm for 0.4 and 0.5 mm pitch packages.
R
A1
2325 Orchard Parkway
San Jose, CA 95131
b
A2
Top View
Side View
L1
D1
TITLE
100T1, 100-lead (14 x 14 x 1.0 mm Body), Thin Plastic
Quad Flat Pack (TQFP)
E1
AT40K/AT40KLV Series FPGA
SYMBOL
XX
A1
A2
D
D1
E
E1
e
b
L1
Bottom View
0.05
0.95
0.17
COMMON DIMENSIONS
MIN
(Unit of Measure = mm)
D
16.00 BSC
14.00 BSC
16.00 BSC
14.00 BSC
0.50 BSC
1.00 REF
NOM
1.00
0.22
N
DRAWING NO.
0.15
1.05
0.27
100T1
MAX
NOTE
E
6
2, 3
2, 3
4, 5
11/30/01
REV.
A
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