CY7C68013A-56LFXC Cypress Semiconductor Corp, CY7C68013A-56LFXC Datasheet - Page 60

• Manufacturer Part Number: CY7C68013A-56LFXC
• Description: IC MCU USB PERIPH HI SPD 56VQFN
• Manufacturer: Cypress Semiconductor Corp
• Series: EZ-USB FX2LP™r

Specifications of CY7C68013A-56LFXC

• Applications: USB Microcontroller
• Core Processor: 8051
• Program Memory Type: ROMless
• Controller Series: CY7C680xx
• Ram Size: 16K x 8
• Interface: I²C, USB, USART
• Number Of I /o: 24
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 56-VQFN Exposed Pad, 56-HVQFN, 56-SQFN, 56-DHVQFN
• For Use With: CY4611B - KIT USB TO ATA REFERENCE DESIGN428-1677 - KIT DEVELOPMENT EZ-USB FX2LP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 428-1669

14. Quad Flat Package No Leads (QFN) Package Design Notes
Electrical contact of the part to the Printed Circuit Board (PCB)
is made by soldering the leads on the bottom surface of the
package to the PCB. Hence, special attention is required to the
heat transfer area below the package to provide a good thermal
bond to the circuit board. Design a Copper (Cu) fill in the PCB as
a thermal pad under the package. Heat is transferred from the
FX2LP through the device’s metal paddle on the bottom side of
the package. Heat from here is conducted to the PCB at the
thermal pad. It is then conducted from the thermal pad to the
PCB inner ground plane by a 5 x 5 array of via. A via is a plated
through hole in the PCB with a finished diameter of 13 mil. The
QFN’s metal die paddle must be soldered to the PCB’s thermal
pad. Solder mask is placed on the board top side over each via
to resist solder flow into the via. The mask on the top side also
minimizes outgassing during the solder reflow process.
Document #: 38-08032 Rev. *M
Via hole for thermally connecting the
QFN to the circuit board ground plane.
Figure 41. Cross-section of the Area Underneath the QFN Package
PCB Material
Figure 42. Plot of the Solder Mask (White Area)
Figure 43. X-ray Image of the Assembly
Cu Fill
Solder Mask
0.013” dia
0.017” dia
For further information on this package design refer to Appli-
cation Notes for Surface Mount Assembly of Amkor's MicroLead-
Frame (MLF) Packages. You can find this on Amkor's website
http://www.amkor.com.
The application note provides detailed information about board
mounting guidelines, soldering flow, rework process, etc.
Figure 41
package. The cross section is of only one via. The solder paste
template should be designed to allow at least 50% solder
coverage. The thickness of the solder paste template should be
5 mil. Use the No Clean type 3 solder paste for mounting the part.
Nitrogen purge is recommended during reflow.
Figure 42
displays an X-Ray image of the assembly (darker areas indicate
solder).
This figure only shows the top three layers of the
circuit board: Top Solder, PCB Dielectric, and
the Ground Plane
Cu Fill
is a plot of the solder mask pattern and
shows a cross-sectional area underneath the
PCB Material
CY7C68013A, CY7C68014A
CY7C68015A, CY7C68016A
Page 60 of 62
Figure 43
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