CY7C63723-SXC Cypress Semiconductor Corp, CY7C63723-SXC Datasheet - Page 48

• Manufacturer Part Number: CY7C63723-SXC
• Description: IC MCU 8K LS USB/PS-2 18-SOIC
• Manufacturer: Cypress Semiconductor Corp
• Series: enCoRe™r

Specifications of CY7C63723-SXC

• Applications: USB Microcontroller
• Core Processor: M8B
• Program Memory Type: OTP (8 kB)
• Controller Series: CY7C637xx
• Ram Size: 256 x 8
• Interface: PS2, USB
• Number Of I /o: 10
• Voltage - Supply: 4 V ~ 5.5 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 18-SOIC (7.5mm Width)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 428-1720-5; CY7C63723-SXC

28.0
Table 28-1 below shows the die pad coordinates for the
CY7C63722-XC. The center location of each bond pad is
relative to the bottom left corner of the die which has
coordinate (0,0).
Table 28-1. CY7C63722-XC Probe Pad Coordinates in microns ((0,0) to bond pad centers)
enCoRe is a trademark of Cypress Semiconductor Corporation. All product and company names mentioned in this document
may be the trademarks of their respective holders.
Document #: 38-08022 Rev. *B
© Cypress Semiconductor Corporation, 2004. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be
used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its
products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
Pad Number
Package Diagrams
10
12
13
14
15
16
17
18
19
20
21
22
23
24
25
11
1
2
3
4
5
6
7
8
9
Die Step: 1907 x 3011 microns
Die Size: 1830.8 x 2909 microns
Die Thickness: 14 mils = 355.6 microns
Pad Size: 80 x 80 microns
(continued)
Pin Name
XTALOUT
XTALIN
VREG
P0.0
P0.1
P0.2
P0.3
P1.0
P1.2
P1.4
P1.6
P1.7
P1.5
P1.3
P1.1
P0.7
P0.6
P0.5
P0.4
Vpp
Vss
Vss
Vcc
D–
D+
Cypress Logo
Y
(0,0)
10
4
5
6
7
8
9
DIE FORM
X
17
22
21
20
19
18
(1907, 3001)
(microns)
1066.55
1210.75
1449.75
1662.35
1735.35
1752.05
1752.05
1752.05
1752.05
1752.05
1393.25
1171.80
788.95
597.45
406.00
154.95
154.95
154.95
154.95
154.95
154.95
154.95
363.90
531.70
980.35
X
(microns)
2843.15
2843.15
2843.15
2687.95
2496.45
2305.05
1922.05
1730.90
1832.75
2024.30
2215.75
2407.15
2598.65
2843.15
2843.15
2843.15
2113.60
CY7C63722
CY7C63723
CY7C63743
312.50
184.85
184.85
184.85
184.85
184.85
184.85
289.85
Y
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