PCX745BVZFU350LE Atmel, PCX745BVZFU350LE Datasheet - Page 17

• Manufacturer Part Number: PCX745BVZFU350LE
• Description: IC MPU 32BIT 350MHZ 255PBGA
• Manufacturer: Atmel

Specifications of PCX745BVZFU350LE

• Processor Type: PowerPC 32-Bit RISC
• Speed: 350MHz
• Voltage: 2V
• Mounting Type: Surface Mount
• Package / Case: 255-PBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -

6. Thermal Characteristics
6.1
Table 6-1.
Notes:
Note:
6.1.1
Table 6-2.
Notes:
2138G–HIREL–05/06
Characteristic
Junction-to-ambient thermal resistance, natural convection
Junction-to-ambient thermal resistance, natural convection, four-layer
(2s2p) board
Junction-to-ambient thermal resistance, 200 ft./min. airflow, single-layer
(1s) board
Junction-to-ambient thermal resistance, 200 ft./min. airflow, four-layer
(2s2p) board
Junction-to-board thermal resistance
Junction-to-case thermal resistance
Characteristic
Junction-to-bottom of balls
Junction-to-ambient thermal resistance, natural convection,
four-layer (2s2p) board
Junction to board thermal resistance
Package Characteristics
1. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) tempera-
2. Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
3. Per JEDEC JESD51-6 with the board horizontal.
4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on
5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Refer to
1. Simulation, no convection air flow
2. Per JEDEC JESD51-6 with the board horizontal
3. Per JEDEC JESD51-8
4. Per JEDEC JESD51-2 with the board horizontal
Package Thermal Characteristics for HiTCE
()(3)
ture, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
the top surface of the board near the package.
Method 1012.1) with the calculated case temperature. The actual value of Rθ
()(3)
()(3)
Package Thermal Characteristics
Package Thermal Characteristics for HiTCE Package
Section 6.1.3 ”Thermal Management Information” on page 19
(1)
Table 6-1
Table 6-2
(5)
(4)
provides the package thermal characteristics for the PC755.
provides the package thermal characteristics for the PC755, HiTCE.
()(2)
Symbol
Rθ
Rθ
Rθ
JMA
JB
J
Symbol
Rθ
Rθ
Rθ
Rθ
Rθ
Rθ
for more details about thermal management.
JMA
JMA
JMA
JA
JB
JC
PC755 HiTCE
20.7
11.0
6.8
JC
PC755
CBGA
(1)(2)
< 0.1
for the part is less than 0.1
24
17
18
14
8
Value
PC745 HiTCE
PC755
PBGA
Value
< 0.1
20.9
31
25
25
21
17
10.2
6.5
(1)(4)
(3)
PC755/745
PC745
PBGA
< 0.1
34
26
27
22
17
°
C/W.
°
°
°
Unit
C/W
C/W
C/W
°
°
°
°
°
°
Unit
C/W
C/W
C/W
C/W
C/W
C/W
17