TSPC603RVGH8LC Atmel, TSPC603RVGH8LC Datasheet - Page 2

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TSPC603RVGH8LC

Manufacturer Part Number
TSPC603RVGH8LC
Description
IC MPU 32BIT 8MHZ 255CBGA
Manufacturer
Atmel
Datasheet

Specifications of TSPC603RVGH8LC

Processor Type
PowerPC 603e 32-Bit RISC
Speed
200MHz
Voltage
2.5V
Mounting Type
Surface Mount
Package / Case
255-CBGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Features
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
TSPC603RVGH8LC
Manufacturer:
Atmel
Quantity:
10 000
2. Screening/Quality/Packaging
2
TSPC603R
Ceramic Leaded Chip Carrier
CERQUAD 240
CERQUAD 240
Cavity up
A suffix
The 603R uses an advanced, 2.5/3.3V CMOS process technology and maintains full interface
compatibility with TTL devices. It also integrates in-system testability and debugging features
through JTAG boundary-scan capabilities.
This product is manufactured in full compliance with:
• HiTCE CBGA according to Atmel Standards
• CI-CGA 255 and Cerquad: MIL-PRF-38535 class Q or according to Atmel standards
• CBGA 255: Upscreenings based upon Atmel standards
• CBGA, CI-CGA, HiTCE packages:
• Cerquad:
• Internal I/O Power Supply = 2.5 ±5% // 3.3V ±5%
– Full military temperature range (T
– Industrial temperature range
– Full military temperature range (T
– Industrial temperature range
– Commercial temperature ranges (
Ceramic Ball Grid Array
Ceramic Ball Grid Array
CBGA 255
HiTCE 255
GH suffix
G suffix
(T
(T
C
C
C
C
T
= -40°C, T
= -40°C, T
C
= -55°C, T
= -55°C, T
= 0°C,
T
C
j
c
j
c
= +110°C)
= +125°C)
= +110°C)
= +70°C)
= +125°C)
with Solder Column Interposer (SCI)
Ceramic Ball Grid Array
CI-CGA 255
GS suffix
5410B–HIREL–09/05

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