ISP1105BSTM ST-Ericsson Inc, ISP1105BSTM Datasheet - Page 29

IC USB TXRX 12/1.5MBITS 16-HVQFN

ISP1105BSTM

Manufacturer Part Number
ISP1105BSTM
Description
IC USB TXRX 12/1.5MBITS 16-HVQFN
Manufacturer
ST-Ericsson Inc
Type
Transceiverr
Datasheet

Specifications of ISP1105BSTM

Number Of Drivers/receivers
1/1
Protocol
USB 2.0
Voltage - Supply
4 V ~ 5.5 V
Mounting Type
Surface Mount
Package / Case
16-VQFN Exposed Pad, 16-HVQFN, 16-SQFN, 16-DHVQFN
For Use With
ISP1105BS EVAL KIT - EVAL KIT FOR NXP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
568-1877-2
ISP1105BS,118
ISP1105BS-T

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ISP1105BSTM
Manufacturer:
NXP/恩智浦
Quantity:
20 000
Philips Semiconductors
Contents
1
2
3
4
4.1
5
6
6.1
6.2
7
7.1
7.2
7.3
7.4
8
8.1
8.2
9
10
11
12
13
14
15
16
16.1
16.2
16.3
16.4
16.5
17
17.1
17.2
18
19
20
21
© Koninklijke Philips Electronics N.V. 2004.
Printed in The Netherlands
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner.
The information presented in this document does not form part of any quotation or
contract, is believed to be accurate and reliable and may be changed without notice. No
liability will be accepted by the publisher for any consequence of its use. Publication
thereof does not convey nor imply any license under patent- or other industrial or
intellectual property rights.
Date of release: 19 February 2004
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . . 7
Electrostatic discharge (ESD). . . . . . . . . . . . . 10
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 11
Recommended operating conditions. . . . . . . 11
Static characteristics. . . . . . . . . . . . . . . . . . . . 12
Dynamic characteristics . . . . . . . . . . . . . . . . . 15
Test information . . . . . . . . . . . . . . . . . . . . . . . . 17
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 18
Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Additional soldering information . . . . . . . . . . 25
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 26
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 27
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5
Function selection. . . . . . . . . . . . . . . . . . . . . . . 7
Operating functions. . . . . . . . . . . . . . . . . . . . . . 7
Power supply configurations . . . . . . . . . . . . . . . 8
Power supply input options . . . . . . . . . . . . . . . . 9
ESD protection . . . . . . . . . . . . . . . . . . . . . . . . 10
ESD test conditions . . . . . . . . . . . . . . . . . . . . 10
Introduction to soldering surface mount
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 22
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 22
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 23
Package related soldering information . . . . . . 23
(H)BCC packages: footprint . . . . . . . . . . . . . . 25
(H)BCC packages: reflow soldering profile. . . 25
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Document order number: 9397 750 11231
Advanced USB transceivers
ISP1105/1106

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