ADM3222ARWZ Analog Devices Inc, ADM3222ARWZ Datasheet - Page 11

• Manufacturer Part Number: ADM3222ARWZ
• Description: IC TXRX RS-232 3.3V W/SD 18-SOIC
• Manufacturer: Analog Devices Inc
• Type: Transceiverr

Specifications of ADM3222ARWZ

• Number Of Drivers/receivers: 2/2
• Protocol: RS232
• Voltage - Supply: 3 V ~ 5.5 V
• Mounting Type: Surface Mount
• Package / Case: 18-SOIC (7.5mm Width)
• Device Type: Transceiver
• Ic Interface Type: RS232
• No. Of Drivers: 2
• Supply Voltage Range: 3V To 5.5V
• Driver Case Style: SOIC
• No. Of Pins: 18
• Operating Temperature Range: -40°C To +85°C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

0.150 (3.81)
0.130 (3.30)
0.115 (2.92)
COPLANARITY
0.210 (5.33)
0.30 (0.0118)
0.10 (0.0039)
0.022 (0.56)
0.018 (0.46)
0.014 (0.36)
0.10
MAX
Figure 25. 18-Lead Standard Small Outline Package [SOIC_W]
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
CORNER LEADS MAY BE CONFIGURED AS WHOLE OR HALF LEADS.
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
Figure 24. 18-Lead Plastic Dual In-Line Package [PDIP]
18
0.070 (1.78)
0.060 (1.52)
0.045 (1.14)
1
(0.0500)
0.100 (2.54)
18
1.27
BSC
Dimensions shown in inches and (millimeters)
1
Dimensions shown in millimeters and (inches)
0.920 (23.37)
0.900 (22.86)
0.880 (22.35)
BSC
11.75 (0.4626)
11.35 (0.4469)
COMPLIANT TO JEDEC STANDARDS MS-013-AB
COMPLIANT TO JEDEC STANDARDS MS-001
0.51 (0.0201)
0.31 (0.0122)
10
9
10
9
Narrow Body
0.280 (7.11)
0.250 (6.35)
0.240 (6.10)
0.005 (0.13)
MIN
7.60 (0.2992)
7.40 (0.2913)
Wide Body
(RW-18)
SEATING
PLANE
0.015
(0.38)
MIN
SEATING
PLANE
(N-18)
2.65 (0.1043)
2.35 (0.0925)
10.65 (0.4193)
10.00 (0.3937)
0.015 (0.38)
0.060 (1.52)
GAUGE
PLANE
0.33 (0.0130)
0.20 (0.0079)
MAX
8°
0°
0.430 (10.92)
0.325 (8.26)
0.310 (7.87)
0.300 (7.62)
MAX
0.014 (0.36)
0.010 (0.25)
0.008 (0.20)
1.27 (0.0500)
0.40 (0.0157)
0.195 (4.95)
0.130 (3.30)
0.115 (2.92)
45°
Rev. D | Page 11 of 12
COPLANARITY
COPLANARITY
2.00 MAX
0.10
0.15
0.05
0.05 MIN
PIN 1
Figure 26. 20-Lead Thin Shrink Small Outline Package [TSSOP]
0.10
Figure 27. 20-Lead Shrink Small Outline Package [SSOP]
20
0.65 BSC
1
BSC
0.65
20
1
0.30
0.19
COMPLIANT TO JEDEC STANDARDS MO-153-AC
COMPLIANT TO JEDEC STANDARDS MO-150-AE
ADM3202/ADM3222/ADM1385
6.60
6.50
6.40
7.50
7.20
6.90
Dimensions shown in millimeters
Dimensions shown in millimeters
1.20 MAX
0.38
0.22
10
11
11
10
SEATING
PLANE
(RU-20)
(RS-20)
5.60
5.30
5.00
1.85
1.75
1.65
SEATING
PLANE
4.50
4.40
4.30
8.20
7.80
7.40
0.20
0.09
6.40 BSC
8°
4°
0°
8°
0°
0.25
0.09
0.95
0.75
0.55
0.75
0.60
0.45