PIC18F23K22-I/ML Microchip Technology Inc., PIC18F23K22-I/ML Datasheet - Page 426

• Manufacturer Part Number: PIC18F23K22-I/ML
• Description: 8KB, FLASH, 768BYTES-RAM, 8-BIT FAMILY, NANOWATT XLP, 28 QFN 6X6MM TUBE
• Manufacturer: Microchip Technology Inc.

Specifications of PIC18F23K22-I/ML

• A/d Inputs: 17-Channel, 10-Bit
• Comparators: 2
• Cpu Speed: 16 MIPS
• Eeprom Memory: 1K Bytes
• Input Output: 24
• Interface: I2C/SPI/UART/USART
• Memory Type: Flash
• Number Of Bits: 8
• Package Type: 28-pin QFN
• Programmable Memory: 8K Bytes
• Ram Size: 512 Bytes
• Speed: 48 MHz
• Temperature Range: –40 to 125 °C
• Timers: 1-8-bit, 3-16-bit
• Voltage, Range: 1.8-5.5 V
• Lead Free Status / Rohs Status: RoHS Compliant part

PIC18(L)F2X/4XK22
27.2
DS41412D-page 426
D017
D018
Note 1:
Param
PIC18LF2X/4XK22
PIC18F2X/4XK22
No.
2:
3:
DC Characteristics: Power-Down Current, PIC18(L)F2X/4XK22 (Continued)
DAC
FVR
Device Characteristics
The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is
measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to V
and all features that add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).
BOR, HLVD and FVR enable internal band gap reference. With both modules enabled, current consump-
tion will be less than the sum of both specifications.
A/D converter differential currents apply only in Run mode. In Sleep or Idle mode both the ADC and the
FRC turn off as soon as conversion (if any) is complete.
Standard Operating Conditions (unless otherwise stated)
Operating temperature
Standard Operating Conditions (unless otherwise stated)
Operating temperature
+25°C
Typ
12
20
12
20
33
15
15
30
35
70
+60°C
Typ
Preliminary
+85°C
Max
100
20
30
20
30
50
25
25
45
55
+125°C
-40°C  T
-40°C  T
Max
100
20
30
20
30
50
25
25
45
55
A
A
Units
A
A
A
A
A
A
A
A
A
A
 +125°C
 +125°C
1.8V
3.0V
1.8V
3.0V
5.0V
1.8V
3.0V
1.8V
3.0V
5.0V
V
DD
 2010 Microchip Technology Inc.
Conditions
Notes
DD
or V
SS