KHX1600C9AD3/2G ValueRAM, KHX1600C9AD3/2G Datasheet
KHX1600C9AD3/2G
Manufacturer Part Number
KHX1600C9AD3/2G
Description
Manufacturer
ValueRAM
Datasheet
1.KHX1600C9AD32G.pdf
(2 pages)
Specifications of KHX1600C9AD3/2G
Lead Free Status / Rohs Status
Supplier Unconfirmed
Document No. 4805801-001.A00
DESCRIPTION:
This document describes Kingston's 256M x 64-bit 2GB (2048MB) DDR3-1600MHz CL9 SDRAM (Synchronous
DRAM) memory module, based on sixteen 128M x 8-bit DDR3 FBGA components. This module has been tested to run
at DDR3-1600MHz at a low latency timing of 9-9-9-27 at 1.65V. The SPD is programmed to JEDEC standard latency
DDR3-1333MHz timing of 9-9-9 at 1.5V. This 240-pin DIMM uses gold contact fingers and requires +1.5V. The JEDEC
standard electrical and mechanical specifications are as follows:
FEATURES:
PERFORMANCE:
JEDEC standard 1.5V ± 0.075V Power Supply
VDDQ = 1.5V ± 0.075V
667MHz fCK for 1333Mb/sec/pin
8 independent internal bank
Programmable CAS Latency: 5,6,7,8,9,10
Posted CAS
Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
Programmable CAS Write Latency(CWL) = 7(DDR3-1333)
8-bit pre-fetch
Burst Length: 8 (Interleave without any limit, sequential with starting address “000” only), 4 with tCCD = 4
which does not allow seamless read or write [either on the fly using A12 or MRS]
Bi-directional Differential Data Strobe
Internal(self) calibration : Internal self calibration through ZQ pin (RZQ : 240 ohm ± 1%)
On Die Termination using ODT pin
Average Refresh Period 7.8us at lower then TCASE 85°C, 3.9us at 85°C < TCASE . 95°C
Asynchronous Reset
PCB : Height 1.180” (30.00mm), double sided component
CL(IDD)
Row Cycle Time (tRCmin)
Refresh to Active/Refresh Command Time (tRFCmin)
Row Active Time (tRASmin)
Power
UL Rating
Operating Temperature
Storage Temperature
T E C H N O L O G Y
2GB 256M x 64-Bit DDR3-1600MHz
KHX1600C9AD3/2G
CL9 240-Pin DIMM
10/01/10
T
E
9 cycles
49.5ns (min.)
110ns
36ns (min.)
1.800 W (operating)
94 V - 0
0
-55
C
H
o
N
O
C to 85
L
o
O
G
Y
C to +100
o
C
o
C
Page 1
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KHX1600C9AD3/2G Summary of contents
Page 1
... Average Refresh Period 7.8us at lower then TCASE 85°C, 3.9us at 85°C < TCASE . 95°C Asynchronous Reset PCB : Height 1.180” (30.00mm), double sided component PERFORMANCE: CL(IDD) Row Cycle Time (tRCmin) Refresh to Active/Refresh Command Time (tRFCmin) Row Active Time (tRASmin) Power UL Rating Operating Temperature Storage Temperature Document No. 4805801-001.A00 KHX1600C9AD3/2G CL9 240-Pin DIMM cycles 49 ...
Page 2
... MODULE DIMENSIONS Units: millimeters w/ Heat Sink Assembly Document No. 4805801-001.A00 ValueRAM d Page 2 ...