MRF275G M/A-COM Technology, MRF275G Datasheet - Page 17

• Manufacturer Part Number: MRF275G
• Description: RF MOSFET Power 5-500MHz 150Watts 28Volt 10dB
• Manufacturer: M/A-COM Technology

Specifications of MRF275G

• Configuration: Dual
• Drain-source Breakdown Voltage: 65 V
• Gate-source Breakdown Voltage: 40 V
• Continuous Drain Current: 26 A
• Power Dissipation: 400 W
• Maximum Operating Temperature: + 150 C
• Package / Case: Case 375-04
• Minimum Operating Temperature: - 65 C
• Transistor Polarity: N-Channel
• Lead Free Status / Rohs Status: Details

17
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
The RF MOSFET Line
150W, 500MHz, 28V
MRF275G
MOSFET CAPACITANCES
tors between the terminals. The metal oxide gate struc-
ture determines the capacitors from gate–to–drain (Cgd),
and gate–to–source (Cgs). The PN junction formed dur-
ing the fabrication of the MOSFET results in a junction
capacitance from drain–to–source (Cds).
output (Coss) and reverse transfer (Crss) capacitances
on datasheets. The relationships between the inter–
terminal capacitances and those given on data sheets
are shown below. The Ciss can be specified in two ways:
The physical structure of a MOSFET results in capaci-
These capacitances are characterized as input (Ciss),
1.
2.
Drain shorted to source and positive voltage at
the gate.
Positive voltage of the drain in respect to source
and zero volts at the gate. In the latter case the
numbers are lower. However, neither method
represents the actual operating conditions in RF
applications.
RF POWER MOSFET CONSIDERATIONS
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
was measured using method 2 above. It should be noted
that Ciss, Coss, Crss are measured at zero drain current
and are provided for general information about the de-
vice. They are not RF design parameters and no attempt
should be made to use them as such.
DRAIN CHARACTERISTICS
the full–on condition. This on–resistance, VDS(on), oc-
curs in the linear region of the output characteristic and is
specified under specific test conditions for gate–source
voltage and drain current. For MOSFETs, VDS(on) has a
positive temperature coefficient and constitutes an impor-
tant design consideration at high temperatures, because
it contributes to the power dissipation within the device.
GATE CHARACTERISTICS
is electrically isolated from the source by a layer of oxide.
The input resistance is very high — on the order of 109
ohms — resulting in a leakage current of a few nanoam-
peres. Gate control is achieved by applying a positive
voltage slightly in excess of the gate–to–source threshold
voltage, VGS(th).
age rating (or any of the maximum ratings on the front
page). Exceeding the rated VGS can result in permanent
damage to the oxide layer in the gate region.
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The Ciss given in the electrical characteristics table
One figure of merit for a FET is its static resistance in
The gate of the MOSFET is a polysilicon material, and
Gate Voltage Rating — Never exceed the gate volt-
M/A-COM Products
Released - Rev. 07.07