TDGL003 Microchip Technology, TDGL003 Datasheet - Page 183

• Manufacturer Part Number: TDGL003
• Description: ChipKIT Max32 Development Board PIC32 Boards And Kits
• Manufacturer: Microchip Technology
• Series: PIC® 32MXr
• Type: MCUr

Specifications of TDGL003

• Silicon Manufacturer: Microchip
• Core Architecture: MIPS
• Core Sub-architecture: PIC32
• Silicon Core Number: PIC32MX
• Silicon Family Name: PIC32MX795Fxxxx
• Kit Contents: Board Only
• Contents: Board
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• For Use With/related Products: MPLAB®, Arduino™ Mega

FIGURE 29-18:
© 2011 Microchip Technology Inc.
ch0_dischrg
ch1_dischrg
1 – Software sets ADxCON. SAMP to start sampling.
2 – Sampling starts after discharge period. T
3 – Software clears ADxCON. SAMP to start conversion.
4 – Sampling ends, conversion sequence starts.
5 – Convert bit 9.
6 – Convert bit 8.
7 – Convert bit 0.
8 – One T
Instruction
ch0_samp
ch1_samp
Execution
Buffer(0)
Buffer(1)
ADCLK
CONV
SAMP
ADxIF
(DS61104) of the “PIC32 Family Reference Manual”.
eoc
Set SAMP
AD
AD61
for end of conversion.
AD50
ANALOG-TO-DIGITAL CONVERSION (10-BIT MODE) TIMING CHARACTERISTICS
(CHPS<1:0> = 01, SIMSAM = 0, ASAM = 0, SSRC<2:0> = 000)
1
Clear SAMP
2
AD60
T
SAMP
3
4
SAMP
5
is described in Section 17. “10-bit Analog-to-Digital Converter (ADC)”
6
AD55
7
8
PIC32MX3XX/4XX
5
6
AD55
7
DS61143H-page 183
8