TDGL003 Microchip Technology, TDGL003 Datasheet - Page 189

• Manufacturer Part Number: TDGL003
• Description: ChipKIT Max32 Development Board PIC32 Boards And Kits
• Manufacturer: Microchip Technology
• Series: PIC® 32MXr
• Type: MCUr

Specifications of TDGL003

• Silicon Manufacturer: Microchip
• Core Architecture: MIPS
• Core Sub-architecture: PIC32
• Silicon Core Number: PIC32MX
• Silicon Family Name: PIC32MX795Fxxxx
• Kit Contents: Board Only
• Contents: Board
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• For Use With/related Products: MPLAB®, Arduino™ Mega

FIGURE 29-23:
TABLE 29-41: EJTAG TIMING REQUIREMENTS
© 2011 Microchip Technology Inc.
AC CHARACTERISTICS
EJ1
EJ2
EJ3
EJ4
EJ5
EJ6
EJ7
EJ8
EJ9
Note 1:
Param.
No.
TRST*
T
T
T
T
T
T
T
T
T
TMS
TDO
TCK
RF
TCKCYC
TCKHIGH
TCKLOW
TSETUP
THOLD
TDOOUT
TDOZSTATE
TRSTLOW
These parameters are characterized, but not tested in manufacturing.
TDI
Symbol
T
rf
EJTAG TIMING CHARACTERISTICS
T
TCK Cycle Time
TCK High Time
TCK Low Time
TAP Signals Setup Time Before
Rising TCK
TAP Signals Hold Time After
Rising TCK
TDO Output Delay Time from
Falling TCK
TDO 3-State Delay Time from
Falling TCK
TRST Low Time
TAP Signals Rise/Fall Time, All
Input and Output
TRST*low
Description
T
Tsetup
T
Thold
(1)
T
TCKhigh
T
Standard Operating Conditions: 2.3V to 3.6V
(unless otherwise stated)
Operating temperature
TCKeye
Min.
25
10
10
25
T
—
—
—
5
3
TDOout
T
T
rf
TCKlow
Max.
—
—
—
—
—
—
—
5
5
PIC32MX3XX/4XX
Defined
Units
T
ns
ns
ns
ns
ns
ns
ns
ns
ns
rf
T
-40°C ≤ T
-40°C ≤ T
rf
Undefined
A
A
≤ +85°C for Industrial
≤ +105°C for V-Temp
Conditions
T
T
TDOzstate
rf
DS61143H-page 189
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