MAX13223EEUP+T Maxim Integrated Products, MAX13223EEUP+T Datasheet - Page 2

• Manufacturer Part Number: MAX13223EEUP+T
• Description: IC TXRX RS-232 2TX/2RX 20-TSSOP
• Manufacturer: Maxim Integrated Products
• Type: Transceiverr

Specifications of MAX13223EEUP+T

• Number Of Drivers/receivers: 2/2
• Protocol: RS232
• Voltage - Supply: 3 V ~ 5.5 V
• Mounting Type: Surface Mount
• Package / Case: 20-TSSOP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

±70V Fault-Protected, 3.0V to 5.5V,
2Tx/2Rx RS-232 Transceiver
ABSOLUTE MAXIMUM RATINGS
(Voltages referenced to GND.)
V
V+ ..........................................................................-0.3V to +7.0V
V- ...........................................................................+0.3V to -7.0V
V+ to V- ................................................................................+13V
Input Voltages
Output Voltages
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TSSOP
ELECTRICAL CHARACTERISTICS
(V
wise noted. For V
C4 = 1µF.) (Note 2)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
2
Supply Voltage
Supply Current
Supply Current AutoShutdown
Supply Current Shutdown
LOGIC INPUTS
Input-Logic Low
Input-Logic High
Transmitter Input Hysteresis
Input Leakage Current
RECEIVER OUTPUTS
Output Leakage Current
Output-Voltage Low
Output-Voltage High
CC
CC
T1IN, T2IN, EN, FORCEON, FORCEOFF ..........-0.3V to +6.0V
R1IN, R2IN .......................................................................±70V
T1OUT, T2OUT ................................................................±70V
R1OUT, R2OUT, INVALID ......................-0.3V to (V
Junction-to-Ambient Thermal Resistance (θ
Junction-to-Case Thermal Resistance (θ
_______________________________________________________________________________________
...................................................................... -0.3V to +7.0V
= +3.0V to +5.5V, T
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
PARAMETER
CC
= +3.0V to +3.6V, C1 = C2 = C3 = 0.1µF, C4 = 1µF. For V
A
= -40°C to +85°C, unless otherwise noted. Typical values are at V
I
V
V
RX,OUT,LKG
SYMBOL
V
RX,OUT,LO
V
RX,OUT,HI
V
TX,INHYS
I
T_IN,LO
IN,LKG
T_IN,HI
I
V
ASD
I
SD
CC
JC
) ................20°C/W
JA
) ........73.8°C/W
AutoShutdown disabled (FORCEON =
FORCEON = GND,
R1IN and R2IN idle, T1IN and T2IN idle
T_IN,
V
T_IN, FORCEON,
T_IN,
I
I
OUT
OUT
CC
CC
= V
= +3.3V to +3.6V, +5.0V to +5.5V
= 1.6mA
= -1.0mA
+ 0.3V)
CC
, FORCEON,
, FORCEON,
,
= V
= GND
CONDITIONS
CC
), no load
Short-Circuit Duration
Continuous Power Dissipation (T
Operating Temperature Range .......................... -40°C to +85°C
Junction Temperature ..................................................... +150°C
Storage Temperature Range ............................ -65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
T1OUT, T2OUT.......................................................Continuous
TSSOP (derate 13.6mW/°C above +70°C) ................1084mW
V
V
CC
CC
= +3.3V
= +5.0V
CC
= V
,
= +4.5V to +5.5V, C1 = 47nF, C2 = C3 = 330nF,
CC
,
CC
V
MIN
= +3.3V, T
0.6
3.0
2.0
2.4
CC
-
A
= +70°C)
±0.01
±0.05
V
TYP
0.2
1.0
1.0
0.5
CC
8
A
= +25°C, unless other-
-
MAX
±10
5.5
0.8
0.4
±1
15
10
10
UNITS
mA
μA
μA
μA
μA
V
V
V
V
V
V