MCP23008-E/ML Microchip Technology, MCP23008-E/ML Datasheet - Page 35

• Manufacturer Part Number: MCP23008-E/ML
• Description: IC I/O EXPANDER I2C 8B 20QFN
• Manufacturer: Microchip Technology

Specifications of MCP23008-E/ML

• Interface: I²C
• Number Of I /o: 8
• Interrupt Output: Yes
• Frequency - Clock: 1.7MHz
• Voltage - Supply: 1.8 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 20-VQFN Exposed Pad, 20-HVQFN, 20-SQFN, 20-DHVQFN
• Includes: POR
• Chip Configuration: 8 Bit
• Bus Frequency: 1.7MHz
• Ic Interface Type: I2C, Serial
• No. Of I/o's: 8
• Supply Voltage Range: 4.5V To 5.5V
• Digital Ic Case Style: QFN
• No. Of Pins: 20
• Termination Type: SMD
• Rohs Compliant: Yes
• Filter Terminals: SMD
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: GPIODM-KPLCD - BOARD DEMO LCD GPIO EXP KEYPAD
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

© 2007 Microchip Technology Inc.
18-Lead Plastic Small Outline (SO) – Wide, 7.50 mm Body [SOIC]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
NOTE 1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer (optional)
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
A
A1
N
1
2 3
b
D
Dimension Limits
e
E1
A2
E
Units
A2
A1
E1
L1
D
N
A
E
e
h
L
c
b
MCP23008/MCP23S08
MIN
2.05
0.10
0.25
0.40
0.20
0.31
L
0°
5°
5°
–
h
L1
MILLIMETERS
10.30 BSC
11.55 BSC
1.27 BSC
7.50 BSC
1.40 REF
NOM
18
h
–
–
–
–
–
–
–
–
–
–
Microchip Technology Drawing C04-051B
MAX
2.65
0.30
0.75
1.27
0.33
0.51
15°
15°
8°
–
DS21919E-page 35
c