DS33Z11+ Maxim Integrated Products, DS33Z11+ Datasheet - Page 148

• Manufacturer Part Number: DS33Z11+
• Description: IC MAPPER ETHERNET 169-CSBGA
• Manufacturer: Maxim Integrated Products

Specifications of DS33Z11+

• Applications: Data Transport
• Interface: SPI/Parallel
• Voltage - Supply: 1.8V, 3.3V
• Package / Case: 169-CSBGA
• Mounting Type: Surface Mount
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Note 1: Typical power is 145mW.
Note 2: All outputs loaded with rated capacitance; all inputs between V
Note 3: RST pin held low, or RST bit set.
Note 4: RST pin held low, or RST bit set. All clocks stopped.
11.1 Thermal Characteristics
Note 1: The package is mounted on a four-layer JEDEC standard test board.
Note 2: Theta-JA (θ
standard test board.
11.2 Theta-JA vs. Airflow
Ambient Temperature (Note 1)
Junction Temperature
Theta-JA (θ
14mm CSBGA (Note 2)
Theta-JA (θ
10mm CSBGA (Note 2)
Input Leakage
Output Leakage (when Hi-Z)
Output Voltage (I
Output Voltage (I
Output Voltage (I
Output Voltage (I
Input Voltage
AIR FLOW
(m/s)
2.5
0
1
PARAMETER
PARAMETER
JA
JA
) in Still Air for 169-pin
) in Still Air for 100-pin
JA
OH
OL
OH
OL
169-Pin 14mm CSBGA
) is the junction-to-ambient thermal resistance, when the package is mounted on a four-layer JEDEC
= +4.0mA)
= +12.0mA)
= -4.0mA)
= -8.0mA)
(°C/W)
52.7
45.8
43.8
THETA-JA
SYMBOL
V
V
V
V
-40°C
V
I
V
I
MIN
ILP
LO
OH
OH
OL
OL
IH
IL
100-Pin 10mm CSBGA
148 of 172
All Outputs
All Outputs
REF_CLKO
TSER
CONDITIONS
(°C/W)
+52.7°C/W
+47.1°C/W
47.1
40.8
38.4
TYP
DD
and V
SS
; inputs with pullups connected to V
+125°C
+85°C
MIN
MAX
-50
-10
2.4
2.4
2.0
TYP
MAX
+10
-10
0.4
0.4
0.8
DD
UNITS
.
µA
µA
V
V
V
V
V
V