1-1734531-2 TE Connectivity, 1-1734531-2 Datasheet

Board to Board / Mezzanine Connectors RCPT 2MM 12P R ANG MT 8AU 3.ST

1-1734531-2

Manufacturer Part Number

1-1734531-2

Description

Board to Board / Mezzanine Connectors RCPT 2MM 12P R ANG MT 8AU 3.ST

Manufacturer

TE Connectivity

Datasheets

1.1-1734493-2.pdf (5 pages)

2.4-1734531-0.pdf (3 pages)

Specifications of 1-1734531-2

Product Type

Receptacles

Pitch

2 mm

Stack Height

4.85 mm

Mounting Style

Through Hole

Mounting Angle

Right

Number Of Positions / Contacts

Number Of Rows

Housing Material

Thermoplastic, Glass Filled

Contact Material

Phosphor Bronze

Contact Plating

Gold (10)

Voltage Rating

200 VAC

Current Rating

1 A

Connector Type

Connector Assembly

Pcb Mount Style

Through Hole

Shrouded

Pcb Mount Retention

Without

Pcb Mounting Orientation

Right Angle

Keyed

Holddown Feature

Without

Post Size (mm [in])

0.50 [.020]

Voltage (vac)

200

Contact - Rated Current (a)

Insulation Resistance (m?)

1,000

Termination Post Length (mm [in])

3.00 [0.118]

Solder Tail Contact Plating

Tin over Nickel

Centerline (mm [in])

2.00 [0.079]

Number Of Positions

Selectively Loaded

Post Number(s) Omitted

None

Centerline, Matrix (mm [in])

2.00 x 2.00 [.079 x .079]

Mating Pin-to-pcb Dimension (mm [in])

1.50 [0.059]

Mount Type

Printed Circuit Board

Cover

Without

Contact Plating, Mating Area, Material

Gold (10)

Contact Base Material

Phosphor Bronze

Connector Style

Receptacle

Dielectric Strength (vac)

650

Ul Flammability Rating

UL 94V-0

Housing Color

Black

Housing Entry Style

Closed Top

Stack Height (mm [in])

4.85 [0.191]

Rohs/elv Compliance

RoHS compliant, ELV compliant

Lead Free Solder Processes

Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder capable to 265°C

Rohs/elv Compliance History

Always was RoHS compliant

Approved Standards

UL E28476, CSA LR7189

Temperature Range (°c)

-40 – +105

Pcb Thickness, Recommended (mm [in])

1.57 [0.062]

Packaging Method

Tube

Lead Free Status / Rohs Status

Details

Current page: 1 of 5
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1. SCOPE

Oblic Hu

APPLICABLE DOCUMENTS AND SPECIFICATIONS

applicable product drawing.

1.1.

1.2. 1.2. QUALIFICATION

2.1. 2.1 TYCO SPECIFICATIONS

REQUIREMENTS

3.1. DESIGN AND CONSTRUCTION

Product shall be of the design, construction and physical dimensions specified on the

3.2. MATERIALS

This specification covers the performance, tests and quality requirements for the

AMPMODU, 2.0mm PITCH BOARD-TO-BOARD CONNECTOR.

When tests are performed on the subject product line, the procedures specified in

Tyco 109 series specifications shall be used. All inspections shall be performed

using the applicable inspection plan and product drawing.

The following documents form a part of this specification to the extent specified

herein. In the event of conflict between the requirements of this specification and

the product drawing, the product drawing shall take precedence. In the event of

conflict between the requirements of this specification and the referenced

documents, this specification shall take precedence.

A. Housing：Thermoplastic or Thermoplastic High Temp., UL94V-0.

B. Contact：Copper Alloy, Gold plating on contact area, Tin or Tin-Lead Plating on soldertail over

1.1. CONTENTS

109-1: General Requirements for Test Specifications

109 series: Test Specification as indicated in figure 2 (Comply with MIL-STD-202)

Corporate Bulletin 401-76: Cross-reference between Tyco test Specifications and Military or

501-57197: Test Report.

Commercial Documents.

TYCO Holdings (Bermuda) VII LTD.

Taipei,11070, Taiwan. ROC.

3F, No. 45, Dongsing Road,

TEL : 886-2-8768-2788

Nickel underplating overall.

Taiwan Branch

Product

Specification

AMPMODU, 2.0mm PITCH BOARD-TO-BOARD

CONNECTOR

24-Mar-2006

. This specification is a controlled document.

DATE

CHK

Wei-Jer Ke

24-MAR-2006 Rev B

108-57197

24-Mar-2006

LOC DW

1 of 5

DATE

Related parts for 1-1734531-2

1-1734531-2 Summary of contents

Page 1

... Product shall be of the design, construction and physical dimensions specified on the applicable product drawing. 3.2. MATERIALS A. Housing：Thermoplastic or Thermoplastic High Temp., UL94V-0. B. Contact：Copper Alloy, Gold plating on contact area, Tin or Tin-Lead Plating on soldertail over Nickel underplating overall. DR Oblic Hu TYCO Holdings (Bermuda) VII LTD. ...

Page 2

... RATINGS A. Voltage: 250 VAC rms. B. Current Max C. Operating Temperature: -40° 105° C 3.4. PERFOMANCE AND TEST DESCRIPTION The product is designed to meet the electrical, mechanical and environmental performance requirements specified in Table 2. All tests are performed at ambient environmental conditions per AMP Specification 109-1 unless otherwise specified ...

Page 3

... Subject mated connectors to steady state humidity at 40° C±2° C and 90-95% R.H for 96 hrs. Subject mated connector assemblies on 5 cycle –55 ° C and +80° C for 30 minutes each duration at temperature extremes. MIL-STD-202, Method 107, Condition A Subject connector mounted on printed circuit boards to solder bath at 260±5°C for 5±1 seconds (Flow soldering) ...

Page 4

... Salt Spray 3.5.4.8 Resistance to Soldering Heat (a) Numbers indicate sequence in which tests are performed. (b) Discontinuities shall not be measured. Rev B Test Group Test Sequence (a) 1,5 1,9 1,6 1,5 1,5 1,4 2,4 8 2,4 2,4 2,5 3 2,5 3 4,7 3 Figure 2 108-57197 1,3 1,3 1,5 1,3 2 ...

Page 5

... FIGURE 3. CONTACT RESISTANCE & RESISTANCE TO FLOW SOLDER HEAT Rev B 108-57197 ...

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