SI4735-D60-GU Silicon Laboratories Inc, SI4735-D60-GU Datasheet - Page 39

• Manufacturer Part Number: SI4735-D60-GU
• Description: RF RX FM AM SW LW 24 SSOP
• Manufacturer: Silicon Laboratories Inc
• Series: -r

Specifications of SI4735-D60-GU

• Mfg Application Notes: SI47xx Prog Guide AppNote
• Frequency: 153kHz ~ 279kHz, 520kHz ~ 1.71MHz, 2.3MHz ~ 26.1MHz, 64MHz ~ 108MHz
• Sensitivity: -
• Data Rate - Maximum: -
• Modulation Or Protocol: AM, FM, SW-LW
• Applications: General Purpose
• Current - Receiving: 18.5mA
• Data Interface: PCB, Surface Mount
• Memory Size: -
• Antenna Connector: PCB, Surface Mount
• Features: RSSI Equipped
• Voltage - Supply: 2 V ~ 5.5 V
• Operating Temperature: -20°C ~ 85°C
• Package / Case: 24-SSOP (0.154", 3.90mm Width)
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 336-2140

9.2. Si473x SSOP
Figure 15 illustrates the PCB land pattern details for the Si473x-D60-GU SSOP. Table 19 lists the values for the
dimensions shown in the illustration.
General:
Solder Mask Design:
Stencil Design:
Card Assembly:
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. This land pattern design is based on the IPC-7351 guidelines.
3. All metal pads are to be non-solder mask defined (NSMD). Clearance between the
4. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should
5. The stencil thickness should be 0.125 mm (5 mils).
6. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pads.
7. A No-Clean, Type-3 solder paste is recommended.
8. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification
solder mask and the metal pad is to be 60 µm minimum, all the way around the pad.
be used to assure good solder paste release.
for Small Body Components.
Dimension
Y1
C
E
X
Table 19. PCB Land Pattern Dimensions
Figure 15. PCB Land Pattern
Rev. 1.0
5.20
0.30
1.50
Min
0.635 BSC
Si4730/31/34/35-D60
Max
5.30
0.40
1.60
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