AT24C128C-SSHM-T Atmel, AT24C128C-SSHM-T Datasheet - Page 18

• Manufacturer Part Number: AT24C128C-SSHM-T
• Manufacturer: Atmel

Specifications of AT24C128C-SSHM-T

• Lead Free Status / Rohs Status: Compliant

18
8U2-1 – VFBGA
Atmel AT24C128C
Notes:
3. Solder ball composition shall be 95.5Sn-4.0Ag-.5Cu.
1. This drawing is for general information.
2. Dimension 'b' is measured at the maximum solder ball diameter.
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Package Drawing Contact:
A1 BALL PAD CORNER
e
(e1)
TITLE
8U2-1, 8-ball, 2.35 x 3.73mm Body,
0.75mm pitch, VFBGA Package (dBGA2)
BOTTOM VIEW
A1 BALL PAD CORNER
TOP VIEW
8 SOLDER BALLS
2
D
1
(d1)
d 0.10
d
A
B
C
D
A
B
e
(4X)
SIDE VIEW
f 0.10 C
SYMBOL
A
A
A
b
D
E
e
e1
d
d1
C
1
2
d 0.08 C
A1
A2
A
j n0.15 m C A B
j n0.08 m C
Øb
0.81
0.15
0.40
0.25
MIN
(Unit of Measure = mm)
COMMON DIMENSIONS
GPC
GWW
2.35 BSC
3.73 BSC
0.75 BSC
0.74 REF
0.75 BSC
0.80 REF
0.91
0.20
0.45
0.30
NOM
DRAWING NO.
8U2-1
1.00
0.25
0.50
0.35
MAX
8734A–SEEPR–1/11
NOTE
07/14/10
REV.
D