TD62001AP Toshiba, TD62001AP Datasheet
TD62001AP
Specifications of TD62001AP
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TD62001AP Summary of contents
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... TOSHIBA Bipolar Digital Integrated Circuit Silicon Monolithic TD62001AP,TD62001AF,TD62002AP,TD62002AF, TD62003AP,TD62003AF,TD62004AP,TD62004AF 7-channel Darlington Sink Driver The TD62001AP/AF Series are high-voltage, high-current darlington drivers comprised of seven NPN darlington pairs. All units feature integral clamp diodes for switching inductive loads. Applications include relay, hammer, lamp and display (LED) drivers ...
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... Input current Clamp diode reverse voltage Clamp diode forward current AP Power dissipation AF Operating temperature Storage temperature Note 1: Except TD62001AP/AF Note 2: Only TD62001AP/AF Note 3: When mounted on a glass-epoxy PCB (30 mm × × 1.6 mm, Cu area: 50%) TD62002AP/AF (Ta = 25°C) Symbol Rating Unit −0 ...
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... Recommended Operating Conditions Characteristics Output sustaining voltage AP Output current AF Except Input voltage TD62001AP/A F TD62002 Input voltage (output on) TD62003 TD62004 TD62001 TD62002 Input voltage (output off) TD62003 TD62004 Input current Only TD62001 Clamp diode reverse voltage Clamp diode forward current AP Power dissipation AF Note: When mounted on a glass-epoxy PCB (30 mm × ...
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Electrical Characteristics (Ta = 25°C unless otherwise noted) Characteristics Ooutput leakage current Collector−emitter saturation voltage DC current transfer ratio TD62002 Input current (output on) TD62003 TD62004 Input current (output off) TD62002 Input voltage (output on) TD62003 TD62004 Clamp diode reverse ...
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Test Circuit 1. I CEX (OFF (sat (ON) 5 TD62001~004AP/AF 3. IIN (ON 2006-06-13 ...
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... ON OFF Note 1: Pulse width 50 µs, duty cycle 10% Output impedance 50 Ω Note 2: Input conditions are shown as following: Input Condition Type Number TD62001AP/AF TD62002AP/AF TD62003AP/AF TD62004AP/AF Note 3: C includes probe and jig capacitance. L Precautions for Using This IC does not include built-in protection circuits for excess current or overvoltage. ...
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TD6200XAF TD6200XAP TD62001~004AP/AF TD6200XAP 7 TD6200XAF 2006-06-13 ...
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TD62001~004AP/AF 8 2006-06-13 ...
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TD62001~004AP/AF 9 2006-06-13 ...
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... TD62001AP/AF TD62002AP/AF TD62003AP/AF TD62004AP/AF Type-AP Free-Air ① ② Type-AF Glass Epoxy PCB 30×30×1.6mm Cu 50% Type-AF Free Air ③ 10 TD62001~004AP/AF 2006-06-13 ...
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Package Dimensions Weight: 1.11 g (Typ.) TD62001~004AP/AF 11 2006-06-13 ...
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Package Dimensions Weight: 0.16 g (Typ.) TD62001~004AP/AF 12 2006-06-13 ...
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Notes on Contents 1. Equivalent Circuits The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. 2. Test Circuits Components in the test circuits are used only to obtain and confirm the ...
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Points to Remember on Handling of ICs (1) Heat Radiation Design In using an IC with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the ...
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... TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property ...