UPC324G2-E1 Renesas Electronics America, UPC324G2-E1 Datasheet - Page 11

• Manufacturer Part Number: UPC324G2-E1
• Manufacturer: Renesas Electronics America
• Type: General Purpose Amplifierr

Specifications of UPC324G2-E1

• Rail/rail I/o Type: No
• Number Of Elements: 4
• Common Mode Rejection Ratio: 65dB
• Input Offset Voltage: 7mV
• Single Supply Voltage (typ): 5/9/12/15/18/24/28V
• Dual Supply Voltage (typ): ±3/±5/±9/±12V
• Power Dissipation: 550mW
• Voltage Gain In Db: 100dB
• Power Supply Requirement: Single/Dual
• Shut Down Feature: No
• Single Supply Voltage (min): 3V
• Single Supply Voltage (max): 30V
• Dual Supply Voltage (min): ±1.5V
• Dual Supply Voltage (max): ±15V
• Technology: Bipolar
• Operating Temp Range: -20C to 80C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 14
• Package Type: SOP
• Lead Free Status / Rohs Status: Not Compliant

RECOMMENDED SOLDERING CONDITIONS
representative.
Surface mount device
µ PC324G2: 14-pin plastic SOP (5.72 mm (225))
Through-hole device
µ PC324C: 14-pin plastic DIP (7.62 mm (300))
Infrared ray reflow
Vapor Phase Soldering
Wave Soldering
Partial heating method
Wave soldering
(only to leads)
Partial heating method
The µ PC324 should be soldered and mounted under the following recommended conditions.
For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
Caution Apply only one kind of soldering condition to a device, except for “partial heating method”, or
Caution For through-hole device, the wave soldering process must be applied only to leads, and make
Process
Process
the device will be damaged by heat stress.
sure that the package body does not get jet soldered.
Peak temperature: 230 °C or below (Package surface temperature),
Reflow time: 30 seconds or less (at 210 °C or higher),
Maximum number of reflow processes: 1 time.
Peak temperature: 215 °C or below (Package surface temperature),
Reflow time: 40 seconds or less (at 200 °C or higher),
Maximum number of reflow processes: 1 time.
Solder temperature: 260 °C or below, Flow time: 10 seconds or less,
Maximum number of flow processes: 1 time,
Pre-heating temperature: 120 °C or below (Package surface temperature).
Pin temperature: 300 °C or below,
Heat time: 3 seconds or less (Per each side of the device).
Solder temperature: 260 °C or below,
Flow time: 10 seconds or less.
Pin temperature: 300 °C or below,
Heat time: 3 seconds or less (per each lead.)
Data Sheet G11763EJ4V0DS
Conditions
Conditions
WS60-00-1
VP15-00-1
IR30-00-1
µ PC324
Symbol
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