ADSP-21266SKSTZ-1B Analog Devices Inc, ADSP-21266SKSTZ-1B Datasheet - Page 2

• Manufacturer Part Number: ADSP-21266SKSTZ-1B
• Manufacturer: Analog Devices Inc

Specifications of ADSP-21266SKSTZ-1B

• Device Core Size: 32b
• Architecture: Super Harvard
• Format: Floating Point
• Clock Freq (max): 150MHz
• Mips: 150
• Device Input Clock Speed: 150MHz
• Ram Size: 256KB
• Program Memory Size: 512KB
• Operating Supply Voltage (typ): 1.2/3.3V
• Operating Supply Voltage (min): 1.14/3.13V
• Operating Supply Voltage (max): 1.26/3.47V
• Operating Temp Range: 0C to 70C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 144
• Package Type: LQFP
• Lead Free Status / Rohs Status: Compliant

ADSP-21261/ADSP-21262/ADSP-21266
TABLE OF CONTENTS
Summary ............................................................... 1
Table of Contents ..................................................... 2
Revision History ...................................................... 2
General Description ................................................. 3
Pin Function Descriptions ....................................... 10
Product Specifications ............................................. 14
REVISION HISTORY
7/09—Rev. E to Rev. F
Corrected all outstanding document errata.
Added temperature grade. See
Clarified VCO operations. See
Voltage Controlled Oscillator .................................... 16
Corrected temperature range on industrial models. See
Ordering Guide ...................................................... 44
Added
Family Core Architecture ........................................ 3
Memory and I/O Interface Features ........................... 4
Target Board JTAG Emulator Connector .................... 8
Development Tools ............................................... 8
Evaluation Kit ...................................................... 9
Designing an Emulator-Compatible DSP Board (Target) 9
Additional Information .......................................... 9
Address Data Pins as Flags .................................... 13
Core Instruction Rate to CLKIN Ratio Modes ............ 13
Address Data Modes ............................................ 13
Operating Conditions .......................................... 14
Automotive Products ..................................... 44
Operating Conditions ....... 14
Rev. F | Page 2 of 44 | July 2009
144-Lead LQFP Pin Configurations ............................ 38
136-Ball BGA Pin Configurations ............................... 39
Outline Dimensions ................................................ 42
Automotive Products .............................................. 44
Ordering Guide ..................................................... 44
Electrical Characteristics ....................................... 14
Package Information ............................................ 15
ESD Caution ...................................................... 15
Maximum Power Dissipation ................................. 15
Absolute Maximum Ratings ................................... 15
Timing Specifications ........................................... 15
Output Drive Currents ......................................... 36
Test Conditions .................................................. 36
Capacitive Loading .............................................. 36
Environmental Conditions .................................... 37
Thermal Characteristics ........................................ 37
Surface-Mount Design .......................................... 43