MD3331-D64-V3-X SanDisk, MD3331-D64-V3-X Datasheet - Page 18

no-image

MD3331-D64-V3-X

Manufacturer Part Number
MD3331-D64-V3-X
Description
Manufacturer
SanDisk
Type
Flash Diskr
Datasheet

Specifications of MD3331-D64-V3-X

Density
64MByte
Operating Supply Voltage (typ)
3.3V
Operating Temperature (min)
-40C
Operating Temperature (max)
85C
Package Type
FBGA
Mounting
Surface Mount
Pin Count
69
Operating Temperature Classification
Industrial
Operating Supply Voltage (min)
2.5V
Operating Supply Voltage (max)
3.6V
Programmable
Yes
Lead Free Status / Rohs Status
Not Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MD3331-D64-V3-X
Manufacturer:
SANDISK
Quantity:
18 135
Part Number:
MD3331-D64-V3-X
Manufacturer:
TI
Quantity:
699
Part Number:
MD3331-D64-V3-X
Quantity:
1 000
Part Number:
MD3331-D64-V3-X
Manufacturer:
M-SYSTEMS
Quantity:
20 000
Company:
Part Number:
MD3331-D64-V3-X
Quantity:
24
Company:
Part Number:
MD3331-D64-V3-X
Quantity:
1 545
3.
3.1
Mobile DiskOnChip Plus consists of the following major functional blocks, as shown in Figure 5.
18
System Interface for host interface
Configuration Interface for configuring Mobile DiskOnChip Plus to operate in 8/16-bit mode,
cascaded configuration and hardware write protection.
Protection and Security-Enabling containing write/read protection and One-Time
Programming (OTP), for advanced data/code security and protection.
Programmable Boot Block with XIP capability enhanced with a Download Engine (DE) for
system initialization capability.
Reed-Solomon-based Error Detection and Error Correction Code (EDC/ECC) for on-the-
fly error handling.
Data Pipeline through which the data flows from the system to the NAND flash arrays.
Control & Status block that contains registers responsible for transferring the address, data
and control information between the TrueFFS driver and the flash
Flash Interface consists of a single 16MB NAND flash array (Figure 5). Mobile DiskOnChip
Plus achieves a 32MB capacity using two stacked 16MB devices in a dual-die package.
Bus Control for translating the host bus address, data and control signals into valid NAND
flash signals.
Address Decoder to enable the relevant unit inside the DiskOnChip controller, according to
the address range received from the system interface.
T
Overview
HEORY OF
O
PERATION
Figure 5: Standard Interface Simplified Block Diagram
Data Sheet, Rev. 1.8
media.
Mobile DiskOnChip Plus 16/32MByte
95-SR-000-10-8L

Related parts for MD3331-D64-V3-X