MD3331-D64-V3-X SanDisk, MD3331-D64-V3-X Datasheet - Page 6

• Manufacturer Part Number: MD3331-D64-V3-X
• Manufacturer: SanDisk
• Type: Flash Diskr

Specifications of MD3331-D64-V3-X

• Density: 64MByte
• Operating Supply Voltage (typ): 3.3V
• Operating Temperature (min): -40C
• Operating Temperature (max): 85C
• Package Type: FBGA
• Mounting: Surface Mount
• Pin Count: 69
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 2.5V
• Operating Supply Voltage (max): 3.6V
• Programmable: Yes
• Lead Free Status / Rohs Status: Not Compliant

10. Product Specifications ........................................................................................................... 54
11. Ordering Information............................................................................................................... 68
How to Contact Us ........................................................................................................................ 69
6
9.3
9.4
9.5
9.6
10.1 Environmental Specifications ........................................................................................... 54
10.2 Disk Capacity.................................................................................................................... 54
10.3 Electrical Specifications.................................................................................................... 55
10.4 Timing Specifications........................................................................................................ 58
10.5 Mechanical Dimensions.................................................................................................... 67
Connecting Signals........................................................................................................... 47
9.3.1
9.3.2
Implementing the Interrupt Mechanism ............................................................................ 48
9.4.1
9.4.2
Platform-Specific Issues ................................................................................................... 49
9.5.1
9.5.2
9.5.3
9.5.4
Device Cascading............................................................................................................. 51
9.6.1
9.6.2
9.6.3
10.1.1 Operating Temperature Ranges......................................................................................... 54
10.1.2 Thermal Characteristics ..................................................................................................... 54
10.1.3 Humidity.............................................................................................................................. 54
10.1.4 Endurance .......................................................................................................................... 54
10.3.1 Absolute Maximum Ratings................................................................................................ 55
10.3.2 Capacitance........................................................................................................................ 55
10.3.3 DC Electrical Characteristics Over Operating Range ........................................................ 56
10.3.4 AC Operating Conditions.................................................................................................... 57
10.4.1 Read Cycle Timing Standard Interface .............................................................................. 58
10.4.2 Write Cycle Timing Standard Interface .............................................................................. 60
10.4.3 Read Cycle Timing Multiplexed Interface........................................................................... 61
10.4.4 Write Cycle Timing Multiplexed Interface........................................................................... 63
10.4.5 Power-Up Timing................................................................................................................ 65
10.4.6 Interrupt Timing .................................................................................................................. 66
Standard Interface.............................................................................................................. 47
Multiplexed Interface .......................................................................................................... 48
Hardware Configuration ..................................................................................................... 48
Software Configuration....................................................................................................... 48
Wait State ........................................................................................................................... 49
Big and Little Endian Systems............................................................................................ 49
Busy Signal......................................................................................................................... 50
Working with 8/16/32-Bit Systems with a Standard Interface ............................................ 50
Standard Interface.............................................................................................................. 51
Multiplexed Interface .......................................................................................................... 52
Memory Map in a Cascaded Configuration........................................................................ 52
Data Sheet, Rev. 1.8
Mobile DiskOnChip Plus 16/32MByte
95-SR-000-10-8L