PPC440GX-3NF533C Applied Micro Circuits Corporation, PPC440GX-3NF533C Datasheet - Page 59

• Manufacturer Part Number: PPC440GX-3NF533C
• Manufacturer: Applied Micro Circuits Corporation

Specifications of PPC440GX-3NF533C

• Family Name: 440GX
• Device Core: PowerPC
• Device Core Size: 32b
• Frequency (max): 533MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 1.5/2.5V
• Operating Supply Voltage (max): 1.6/2.7V
• Operating Supply Voltage (min): 1.4/2.3V
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 552
• Package Type: FCBGA
• Lead Free Status / Rohs Status: Compliant

Revision 1.20 – June 9, 2009
Heat Sink Mounting Information (Ceramic Package Only)
Proper thermal design is primarily dependent upon multiple system-level effects; that is, the effects of the heat
sink, the air flow, and the thermal interface material. To reduce the die-junction temperature, heat sinks may be
attached to the package by several methods: adhesive, spring clips to the printed-circuit board or package, or a
mounting clip and screw assembly. When attaching heat sinks, it is important to avoid placing excessive
mechanical stress on bonding of the chip to the substrate and the package to the board.
Heat Sink Attached With Spring Clip
Heat Sink Attached With Adhesive
Important: All of the guidelines indicated in the above diagrams must be evaluated and adjusted to account for the
shock and vibration effects of any particular application.
AMCC
Data Sheet
Heat sink
Heat sink clip
Heat sink clip
Thermal grease
CBGA
package
Static compression (spring force)—2.27kg maximum
Printed
circuit
board
Printed
circuit
board
Heat sink
Adhesive
CBGA
package
Spring clip to package
Weight
force
440GX – Power PC 440GX Embedded Processor
Heat sink
Heat sink clip
Heat sink clip
Thermal grease
CBGA
package
Printed
circuit
board
Static compression (spring force)—2.27kg maximum
Note 1: Force is limited by allowable compression on the die.
Heat sink
Heat sink weight force—60g maximum
Printed
circuit
board
CBGA
Adhesive
package
Allowable package compression force is 4.4kg.
Spring clip to board
Weight
force
1
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